Electronic Component Sourcing Guides & Hot Part Notes
Long-life articles for OEM, EMS and engineering buyers: part-number sourcing notes, package checks, date-code verification, BOM risk and quality-control guidance.
Google Revisits Five Generations of TPU: Why AI ASICs Still Have Room to Run
What Google's TPU v2-to-Ironwood paper reveals about AI ASIC longevity, HBM, optical interconnects, resilience, power efficiency and the wider component supply chain.
Inside a Xiaomi SU7 T-Box: 5G, Automotive Ethernet, Backup Power and Component Sourcing
An engineering and sourcing review of a Xiaomi SU7 telematics control unit teardown, covering Quectel AG571Q, automotive MCU, Ethernet, CAN FD, memory, audio and…
NOR, NAND, DRAM, DDR, HBM and SRAM Explained: A Practical Memory Glossary
A plain-English guide to volatile and non-volatile memory: SRAM, DRAM, DDR, LPDDR, GDDR, HBM, NAND Flash, NOR Flash and where MCUs fit.
On-Device AI Is the Next Deployment Wave: China-Based Edge AI Chips and Sourcing Priorities
A practical guide to on-device AI, China-based edge AI platforms, deployment tradeoffs and the processor, memory, power and lifecycle checks engineers and buyers…
Space and Defense FPGA Comparison: RTG4 vs AMD XQR vs Pango Titan vs Fudan JFM7—and Where Teledyne Fits
An evidence-based comparison of space and high-reliability FPGA routes, covering radiation data, logic resources, qualification, toolchains and sourcing risk.
China-Based FPGA Vendors as Alternative Platforms: Four Engineering and Sourcing Comparisons
Evaluate four China-based FPGA vendor groups as potentially lower-cost alternative platforms for engineers and component sourcing teams.
How to Identify Counterfeit ICs Before Purchase
A practical inspection guide for buyers checking IC authenticity, including label review, surface marks, laser marking, pin condition, package edge, date code and RFQ…
IC Package Types Explained: A Buyer’s Guide to DIP, SOIC, QFP, QFN, BGA and CSP
A practical IC package guide for component buyers, covering common package types, sourcing checks, part-number suffix risks, packaging condition and RFQ verification…
Original, Refurbished, Remarked and Pulled ICs: What Buyers Should Know
A buyer-focused guide explaining factory sealed stock, opened original packaging, loose new parts, refurbished ICs, remarked devices and used-pull components.
What Is SDRAM? SDR vs DDR and a Practical Guide to Active and Legacy Parts
Learn how SDR SDRAM differs from DDR, why 3.3V SDRAM remains in embedded systems, and how to source Winbond and Micron part numbers safely.
CPU vs GPU vs FPGA vs ASIC vs SoC: Buyer Guide
Compare CPU, GPU, FPGA, ASIC and SoC devices, including SoC vs GPU differences and the package, lifecycle and sourcing checks buyers need.
TDA21490: A Smart Power Stage Moving with the AI Server Cycle
Market and supply chain analysis of Infineon TDA21490, a 90A smart power stage used in AI servers, GPU power delivery, HPC platforms, and high-current DrMOS…