Match density and organization
Capacity alone does not define bus width, bank organization or interface generation.
Memory procurement
Memory ICs and Storage Components
Search published memory part numbers across volatile, non-volatile and managed storage products. Use the exact orderable code to confirm density, organization, interface, speed, voltage, package and temperature grade.
Manufacturer coverage
Leading brands in the current catalogue
Counts come from the live D1 catalogue.Direct part-number access
Published part numbers
Availability, lot and delivery require RFQ confirmation.| Part number | Brand | Product type | Package | Action |
|---|---|---|---|---|
| AT24C02C-SSHM-T | Microchip | Serial EEPROM | SOIC-8 (4.9 × 3.9 mm SMT, Tape and Reel) | Request quote |
| AT24C256C-SSHL-T | Microchip | Serial EEPROM | SOIC-8 (4.9 × 3.9 mm SMT, Tape and Reel) | Request quote |
| BWCTAQK11X32G | BIWIN Storage | eMMC 5.1 | 153-FBGA (11.5 × 13 × 1.0 mm, 0.5 mm pitch) | Request quote |
| CXDB4CBAM-ML-A | CXMT | DDR4 SDRAM | 96-FBGA (96-ball Fine-Pitch BGA) | Request quote |
| EPCS16SI8N | Altera | Configuration PROM | 8-pin SOIC (SI8), 1.27 mm pitch | Request quote |
| GDP2BFLM-WB | GigaDevice | DDR3L SDRAM | 96-FBGA (96-ball Fine-Pitch BGA) | Request quote |
| H26M41204HPR | SK hynix | eMMC Flash | 153-ball FBGA | Request quote |
| H26M41208HPRI | SK hynix | eMMC Flash | 153-ball FBGA | Request quote |
| H26M51002KPR | SK hynix | eMMC 5.1 NAND Flash | 153-FBGA (11.5 × 13 mm) | Request quote |
| H26M62002JPR | SK hynix | eMMC 5.1 NAND Flash | 153-FBGA (11.5 × 13 mm) | Request quote |
| H54G38AYRBX259 | SK hynix | LPDDR4 SDRAM | 200-ball FBGA | Request quote |
| H56G42AS2DX014 | SK hynix | GDDR6 SDRAM | 180-ball FBGA | Request quote |
| H5AG38EXNDX026N | SK hynix | DDR4 SDRAM | 78-FBGA (7.5 × 11 mm, 0.8 mm pitch) | Request quote |
| H5AG44DXNDX116N | SK hynix | DDR4 SDRAM | 78-ball FBGA | Request quote |
| H5AG46DXNDX117N | SK hynix | DDR4 SDRAM Memory | 96-ball FBGA | Request quote |
| H5AG48DXNDX116N | SK hynix | DDR4 SDRAM | 78-ball FBGA ( × 8 / × 16), JEDEC standard | Request quote |
| H5AN4G6NBJR-UHC | SK hynix | DDR4 SDRAM | 96-ball FBGA | Request quote |
| H5AN4G6NBJR-VKC | SK hynix | DDR4 SDRAM | 96-ball FBGA | Request quote |
Before you buy
Selection and sourcing checks
Check package and speed
Ball map, package dimensions, speed bin and voltage must match the approved design.
Control lot expectations
State date-code, matching-lot, packing and traceability requirements before quotation.
Related resources
Engineering and sourcing guides
FAQ
Frequently asked sourcing questions
Which fields are needed for a memory RFQ?
Send the full part number, quantity, package, speed grade, date-code target and delivery destination.
Can the same capacity use a different memory part?
A replacement still requires checks for organization, timing, voltage, package, controller support and qualification.
Can LimChip review a memory BOM?
Yes. Submit complete part numbers and quantities so each line can be checked separately.
Send the exact MPN, quantity and delivery requirements.