FPGA and adaptive computing procurement

AMD Xilinx FPGA and Adaptive SoC Sourcing

Review LimChip’s published AMD Xilinx catalogue across Spartan, Artix, Kintex, Virtex, Zynq and newer adaptive-computing families. This page groups Xilinx-branded FPGA records under the current AMD Xilinx sourcing context and excludes unrelated AMD processor listings.

Catalogue map

AMD Xilinx product areas

Counts come from the current published D1 catalogue.

Direct part-number access

Published AMD Xilinx part numbers

Displayed availability is a catalogue signal; current quantity and lot allocation require RFQ confirmation.
Part numberProduct typePackage / caseDate codeAction
XA7A50T-2CSG324IFPGA324-ball chip-scale BGA (CSG324), 15 × 15 mm, 0.80 mm pitch25+Request quote
XA7S50-1FGGA484QFPGA484-ball fine-pitch BGA (FGGA484), 23 × 23 mm, 1.00 mm pitch26+Request quote
XA7Z020-1CLG400ISoC FPGA400-ball chip-scale BGA (CLG400), 17 × 17 mm, 0.80 mm pitch26+Request quote
XA7Z020-1CLG484QSoC FPGA484-ball chip-scale BGA (CLG484), 19 × 19 mm, 0.80 mm pitch26+Request quote
XC2C256-7VQG100CCPLD100-pin VQFP (VQ100), 14 × 14 mm, 0.50 mm pitch25+Request quote
XC6SLX150-2CSG484ISpartan-6 LX FPGA484-ball chip-scale BGA, 19 × 19 mm, 0.80 mm pitch25+ / 26+Request quote
XC6SLX150-2FGG484CSpartan-6 LX FPGA484-ball fine-pitch BGA, 23 × 23 mm, 1.00 mm pitch25+ / 26+Request quote
XC6SLX150-2FGG484ISpartan-6 LX FPGA484-ball fine-pitch BGA, 23 × 23 mm, 1.00 mm pitch25+ / 26+Request quote
XC6SLX150-3FGG484CSpartan-6 LX FPGA484-ball fine-pitch BGA, 23 × 23 mm, 1.00 mm pitch25+ / 26+Request quote
XC6SLX16-2CSG324IFPGA324-ball chip-scale BGA, 15 × 15 mm, 0.80 mm pitch25+Request quote
XC6SLX45-2FGG484IFPGA484-ball fine-pitch BGA, 23 × 23 mm, 1.00 mm pitch25+Request quote
XC6SLX75T-3FGG484CSpartan-6 LXT FPGA484-ball fine-pitch BGA, 23 × 23 mm, 1.00 mm pitch25+ / 26+Request quote
XC6SLX9-2TQG144CFPGA144-pin TQFP, 20 × 20 mm, 0.50 mm pitch25+Request quote
XC6SLX9-2TQG144ISpartan-6 LX FPGA144-pin TQFP, 20 × 20 mm, 0.50 mm pitch25+ / 26+Request quote
XC7A100T-2FGG484IFPGA484-ball fine-pitch wire-bond BGA (FGG484), 23 × 23 mm, 1.00 mm pitch26+Request quote
XC7A100T-2FGG676IFPGA676-ball fine-pitch wire-bond BGA (FGG676), 27 × 27 mm, 1.00 mm pitch26+Request quote
Open the complete AMD Xilinx catalogue →

Before you buy

AMD Xilinx sourcing checks

Keep the full device code

Device, speed, package and temperature suffixes define the orderable FPGA or SoC.

Validate migration separately

Family membership does not prove pin, transceiver, memory, power or toolchain compatibility.

Confirm packing and traceability

State tray, date code, label and inspection requirements before the lot is allocated.

FPGA and adaptive computing procurement

Related engineering and sourcing guides

FAQ

AMD Xilinx sourcing questions

What should an AMD Xilinx RFQ include?

Provide the full orderable code, quantity, target date code, packing and delivery location.

Why are AMD processors excluded here?

This page is limited to Xilinx FPGA and adaptive SoC sourcing; general AMD processors are a different product intent.

Can a different speed or package grade be supplied?

Only when the buyer’s engineering team approves the electrical, mechanical and timing differences.

Send the exact MPN, quantity and delivery requirements.

Request AMD Xilinx component pricing

Start an RFQsales@limchip.com