Preserve the STM32 suffix
Density, package, temperature and packing fields can change the exact orderable device.
Embedded control and sensing procurement
Search LimChip’s published STMicroelectronics catalogue across STM32 and other embedded controllers, MEMS sensors, analog, power, protection and automotive devices. Keep the complete package, memory, temperature and packing suffix when requesting an ST part.
Catalogue map
Direct part-number access
| Part number | Product type | Package / case | Date code | Action |
|---|---|---|---|---|
| ECMF02-4CMX8 | ESD Protection / Common-Mode Filter | 8-QFN (1.7 × 1.7 mm, 0.4 mm pitch) | 25+ | Request quote |
| L6920DTR | Boost Converter | 8-TSSOP (3 × 4.4 mm, 0.65 mm pitch) | 26+ | Request quote |
| L7805CV | Fixed Linear Regulator | TO-220 (through-hole, 3-pin) | 25+ | Request quote |
| L9369-TR | Motor Driver / H-Bridge IC | QFN (automotive-grade osed pad) | 25+/26+ | Request quote |
| LIS2DH12TR | 3-Axis Accelerometer | 12-LGA (2 × 2 × 1 mm) | 25+/26+ | Request quote |
| LIS2DHTR | 3-Axis Accelerometer | 14-LGA (2 × 2 × 1 mm) | 25+ | Request quote |
| LIS2DW12TR | 3-Axis Accelerometer | 12-LGA (2 × 2 × 0.7 mm) | 25+ | Request quote |
| LIS2MDLTR | 3-Axis Magnetometer | 12-LGA (2 × 2 × 0.7 mm) | 26+ | Request quote |
| LIS3DHTR | 3-Axis Accelerometer | 16-LGA (3 × 3 × 1 mm) | 25+/26+ | Request quote |
| LIS3MDLTR | MEMS Motion Sensor | LGA-12 (2.0 × 2.0 × 1.0 mm SMT, Tape and Reel) | 25+ | Request quote |
| LSM303AGR | 6-Axis eCompass Module | 12-LGA (2 × 2 × 1 mm) | 25+ | Request quote |
| LSM303AGRTR | MEMS Motion Sensor | LGA-12 (2.0 × 2.0 × 1.0 mm SMT, Tape and Reel) | 26+ | Request quote |
| LSM303DTR | MEMS Motion Sensor | LGA-16 (3.0 × 3.0 × 1.0 mm SMT, Tape and Reel) | 26+ | Request quote |
| LSM6DS3TR | 6-Axis IMU (Accel + Gyro) | 14-LGA (2.5 × 3 × 0.83 mm) | 26+ | Request quote |
| LSM6DS3TR-C | 6-Axis IMU (Accel + Gyro) | 14-LGA (2.5 × 3 × 0.83 mm) | 26+ | Request quote |
| LSM6DSLTR | 6-Axis IMU (Accel + Gyro) | 14-LGA (2.5 × 3 × 0.83 mm) | 25+ | Request quote |
Before you buy
Density, package, temperature and packing fields can change the exact orderable device.
A family-level match does not confirm pinout, memory, peripheral or qualification equivalence.
Confirm quantity, date code, packing and label evidence before shipment.
Embedded control and sensing procurement
FAQ
Yes. Send full STM32 orderable codes and quantities through the BOM or RFQ form.
The suffix can identify package, memory, grade and packing, all of which affect procurement.
No. Current quantity and lot allocation are confirmed in the formal quotation.
Send the exact MPN, quantity and delivery requirements.