Space and Defense FPGA Comparison: RTG4 vs AMD XQR vs Pango Titan vs Fudan JFM7—and Where Teledyne Fits

Three questions buyers ask—and why none has a one-line answer

Space and high-reliability FPGA programmes often begin with three questions:

1. Which FPGA has the right radiation performance? 2. Can a China-based FPGA replace Microchip RTG4 or an AMD space-grade device? 3. What is appropriate for a commercial-space mission?

The answer cannot be reduced to one TID number or one logic-cell count. Orbit, mission duration, shielding, radiation environment, criticality, reconfiguration strategy, qualification flow, toolchain, IP and export availability all change the decision. A LEO communications payload and a long-duration GEO control function can require very different evidence.

This comparison reviews five names frequently mentioned in the same sourcing conversation: Microchip RTG4, AMD XQR, Pango Titan, Fudan JFM7 and Teledyne e2v. They are not five equivalent FPGA product families. Teledyne e2v is included because it is relevant to the space compute and screening ecosystem, but the publicly verifiable evidence does not support calling UT250 a Teledyne FPGA competing directly with RTG4.

Corrected five-route comparison

The original claims of fixed RMB prices and 12-, 30- or 40-week lead times are not included. Space-grade quotations depend on screening level, package, documentation, export conditions, lot size and programme approval. Price and availability must be confirmed by current RFQ.

1. Microchip RTG4: radiation mitigation designed into the FPGA

RTG4 originated under Microsemi and is now a Microchip family. It uses a non-volatile Flash configuration architecture and a 65 nm process. Microchip's public product material specifies more than 100 krad TID tolerance, hardened registers and configuration-memory resistance to radiation-induced upsets. QML Class V-qualified RTG4 options are available for programmes requiring that flow.

“SEU immune” should not be applied to the whole device without qualification. RTG4 addresses configuration, registers, clocks, SRAM and other resources with different hardening or mitigation mechanisms. Engineers must read the resource- specific radiation documentation and implement the recommended mitigation for the actual design.

Best-fit review: deterministic control, interfaces and signal-processing functions that benefit from non-volatile configuration and strong public radiation evidence.

RFQ focus: RT4G150 full ordering code, package, temperature range, QML or other screening flow, date code, traceability and applicable radiation reports.

2. AMD XQR: correct the “Virtex-7 space-grade” description

The original comparison mixed the Virtex-7 name with a 20 nm process and more than one million logic elements. AMD's public space portfolio instead identifies the XQRKU060 Kintex UltraScale as the 20 nm radiation-tolerant FPGA. AMD lists 726K system logic cells, 331K LUTs, 38 Mb memory and 32 transceivers at up to 12.5 Gb/s. Its April 2026 data sheet publishes TID and single-event parameters.

Older space devices include Virtex-4QV and Virtex-5QV, while newer XQR Versal adaptive SoCs target substantially higher onboard processing. They should not be collapsed into a generic “Virtex-7 Space-Grade” row.

Unlike RTG4's non-volatile configuration approach, SRAM-based XQR devices need a programme-specific configuration and mitigation strategy. Reconfiguration is an advantage for payload processing, but the architecture must account for configuration upsets, scrubbing, redundancy and recovery.

Best-fit review: high-throughput onboard processing, digital payloads, remote sensing and designs that need large DSP, RAM and transceiver resources.

3. Pango Titan: high resources do not prove a radiation grade

Pango publicly positions Titan as its high-performance FPGA family. Current company material describes Titan-3 products using FinFET technology and up to 1,300K logic elements. The company also states that its overall portfolio spans commercial, industrial, automotive, extended-temperature, radiation-tolerant and radiation-hardened grades.

Those two statements cannot automatically be combined into “a 1,300K-LUT Titan radiation-hardened part.” Before a space programme treats Titan as an RTG4 or XQR alternative, the supplier must identify the exact radiation-grade ordering code and provide device-level evidence.

Request at minimum:

• TID test conditions, dose rate, sample size, bias and pass criteria.
• SEL threshold and destructive-event test results.
• Configuration, block-RAM, register, PLL and transceiver SEE data.
• Process node, package, temperature range and screening flow.
• Toolchain version, IP availability and long-term support plan.

Best-fit review: programmes with a China-based supply requirement and a supplier-supported qualification package—not projects relying only on a Titan family brochure.

4. Fudan JFM7: a real high-performance family, but ask for the space suffix

Fudan Microelectronics publicly describes JFM7 as a high-performance FPGA family and identifies JFM7K325T as a 28 nm product. Company disclosures also show work to migrate JFM7K325T and JFM7K410T from an overseas 28 nm process to a domestic 28 nm process. In 2026, the company publicly displayed space-use FPGAs, dedicated scrubbing devices, Flash memory and radiation-resistant solutions.

That evidence supports JFM7 as a serious China-based FPGA route, but it does not verify the original claims that a generic “JFM7K325T space version” has one fixed radiation grade, a specific price or million-unit space shipments. A process migration can also change the qualification baseline, so buyers must match radiation data to the exact die revision and manufacturing flow.

Best-fit review: domestic high-reliability programmes where the supplier can provide the exact orderable part, process version, radiation report, screening flow and Procise project support.

5. Teledyne e2v: important in space compute, but not the claimed FPGA rival

Teledyne e2v supplies space-grade processors, memories and high-speed data converters, and offers high-reliability screening and qualification services. Its public material discusses systems that pair a Teledyne QLS1046-Space module with AMD XQRKU060, and a 2026 white paper discusses Teledyne converters paired with Microchip RT PolarFire.

That makes Teledyne highly relevant to a space processing BOM, but not evidence that “UT250” is a Teledyne radiation-hardened FPGA. A buyer receiving that name should request the manufacturer's data sheet, full ordering code and product category before adding it to an FPGA comparison.

If the project needs a genuine fifth FPGA vendor, define the required radiation and qualification level first, then evaluate another supplier with public, device-level evidence rather than filling the table with a processor, memory or screening provider.

Radiation terms buyers must not mix

Orbit name alone is insufficient. LEO, MEO, GEO, HEO and deep-space missions have different particles, shielding, duration and upset-recovery opportunities. The programme radiation analysis must set TID and SEE requirements before the FPGA is selected.

Can a China-based FPGA replace RTG4 or AMD XQR?

It may become an approved alternative, but it is not a purchasing-only swap. Cross-vendor migration typically requires:

1. RTL synthesis and place-and-route in the new toolchain. 2. IP, memory, PLL, transceiver and I/O replacement. 3. Timing closure, power analysis and board-level signal-integrity review. 4. Radiation mitigation redesign and verification. 5. Package, pinout, power-rail and PCB changes. 6. Qualification, environmental test and customer approval.

The right comparison is not “logic cells per yuan.” It is mission compliance, engineering effort, radiation evidence, qualification, lifecycle and total programme risk.

Scenario-based selection—not universal winners

Eight RFQ documents to request

• Full manufacturer ordering code and package drawing.
• Lifecycle status and supported programme duration.
• Qualification and screening-flow definition.
• TID report with dose rate, bias, samples and acceptance criteria.
• Heavy-ion SEE/SEL report with LET and operating conditions.
• Resource-specific upset and mitigation guidance.
• Lot traceability, date code, packing and storage condition.
• Export, end-use, end-user and destination compliance requirements.

For high-reliability and space components, LimChip can help organize an RFQ, but the final device approval belongs to the customer's engineering, quality, radiation-assurance and compliance teams. Send the mission class, exact FPGA requirements, quantity, package, screening level and required documentation through the RFQ page. Availability, price, date code and lead time must be confirmed for the exact orderable part.

Primary references

• Microchip RTG4 radiation-tolerant FPGA family
• Microchip RTG4 radiation-effects mitigation white paper
• AMD Kintex UltraScale XQR space-grade FPGA family
• AMD XQRKU060 radiation-tolerant data sheet
• Pango public product and high-reliability portfolio statement
• Fudan Microelectronics 2026 commercial-space product display
• Fudan Microelectronics JFM7 process-migration disclosure
• Teledyne e2v high-reliability component services
• Teledyne e2v QLS1046-Space processing module