Automotive and connected embedded sourcing

NXP Semiconductors Components and Sourcing

Review LimChip’s published NXP catalogue across automotive MCUs, embedded processors, wireless controllers, NFC and secure elements, CAN and other interfaces. The full orderable code is needed to verify package, temperature, qualification and packing.

Catalogue map

NXP product areas

Counts come from the current published D1 catalogue.

Manufacturer portfolio context

What distinguishes NXP

NXP platforms combine processing, vehicle networking and security; software compatibility and lifecycle context are part of a sourcing decision.

AUTOMOTIVE

S32 automotive platform

The S32 platform covers automotive processing and control across vehicle domains, with device choices tied to compute, networking, safety and security requirements.
Official manufacturer source

EDGE PROCESSING

i.MX applications processors

i.MX applications processors serve embedded and edge systems across different CPU, accelerator, multimedia, interface and power envelopes.
Official manufacturer source

SECURITY

Security and authentication

NXP security products include secure elements, authenticators and trusted platform functions whose provisioning and certification requirements must be preserved.
Official manufacturer source

LimChip authored these summaries from the linked manufacturer overviews. The manufacturer documentation controls specifications and product status.

Direct part-number access

Published NXP part numbers

Displayed availability is a catalogue signal; current quantity and lot allocation require RFQ confirmation.
Part numberProduct typePackage / caseDate codeAction
CLRC63201T/0FEMulti-Protocol NFC Reader IC32-SO (SOT287-1), 20.3–20.7×7.4–7.6 mm25+Request quote
FS32K144WAT0WLHTAutomotive MCU64-LQFP, 10×10 mm25+Request quote
FS32K146HFT0MLLTAutomotive MCU100-LQFP, 14×14 mm25+Request quote
FS32K148HAT0VLUTAutomotive MCU176-LQFP26+Request quote
JN5168/001IEEE 802.15.4 Wireless Microcontroller40-HVQFN, 6×6×0.85 mm, 0.5 mm pitch26+Request quote
K32W041ZWireless MCU40-HVQFN, 6×6×0.85 mm, 0.5 mm pitch26+Request quote
KW45B41Z83AFTBTBluetooth Wireless Microcontroller48-HVQFN wettable flanks, 7×7×0.85 mm, 0.5 mm pitch26+Request quote
LPC1766FBD100Arm Cortex-M MCU100-LQFP, 14×14 mm, 0.5 mm pitch25+Request quote
LPC1768FBD100Arm Cortex-M MCU100-LQFP, 14×14 mm, 0.5 mm pitch26+Request quote
LPC1788FBD208Arm Cortex-M MCU208-LQFP, 28×28 mm, 0.5 mm pitch25+Request quote
LPC54616J512BD100EArm Cortex-M MCU100-LQFP, 14×14 mm, 0.5 mm pitch25+Request quote
LPC54628J512ET180EArm Cortex-M MCU180-TFBGA25+Request quote
LPC5516JBD64EArm Cortex-M33 MCU64-HTQFP, 10×10 mm25+Request quote
LPC5528JBD100KArm Cortex-M33 MCU100-HTQFP, 14×14 mm25+Request quote
LPC5528JBD64KArm Cortex-M33 MCU64-HTQFP, 10×10 mm26+Request quote
LPC55S16JBD64EArm Cortex-M33 MCU64-HTQFP, 10×10 mm26+Request quote
Open the complete NXP catalogue →

Before you buy

NXP sourcing checks

Use the complete code

Package, temperature, qualification and packing must be preserved from the approved BOM.

Check platform dependencies

Processor and MCU alternatives may change pinout, memory, peripherals, software and safety assumptions.

State automotive evidence needs

Include grade, date code, lot, label and requested traceability in the RFQ.

Automotive and connected embedded sourcing

Related engineering and sourcing guides

FAQ

NXP sourcing questions

What should an NXP automotive RFQ include?

Provide the complete orderable code, quantity, grade, target date code, packing and destination.

Can a related NXP MCU replace the BOM item?

Only after engineering confirms pinout, peripherals, memory, software and qualification requirements.

Can I submit NXP and other brands in one BOM?

Yes. List each brand, full part number and quantity in one RFQ message for a line-by-line review.

Send the exact MPN, quantity and delivery requirements.

Request NXP component pricing

Start an RFQsales@limchip.com