Use the complete code
Package, temperature, qualification and packing must be preserved from the approved BOM.
Automotive and connected embedded sourcing
NXP Semiconductors Components and Sourcing
Review LimChip’s published NXP catalogue across automotive MCUs, embedded processors, wireless controllers, NFC and secure elements, CAN and other interfaces. The full orderable code is needed to verify package, temperature, qualification and packing.
Catalogue map
NXP product areas
Counts come from the current published D1 catalogue.Direct part-number access
Published NXP part numbers
Displayed availability is a catalogue signal; current quantity and lot allocation require RFQ confirmation.| Part number | Product type | Package / case | Date code | Action |
|---|---|---|---|---|
| CLRC63201T/0FE | Multi-Protocol NFC Reader IC | 32-SO (SOT287-1), 20.3–20.7×7.4–7.6 mm | 25+ | Request quote |
| FS32K144WAT0WLHT | Automotive MCU | 64-LQFP, 10×10 mm | 25+ | Request quote |
| FS32K146HFT0MLLT | Automotive MCU | 100-LQFP, 14×14 mm | 25+ | Request quote |
| FS32K148HAT0VLUT | Automotive MCU | 176-LQFP | 26+ | Request quote |
| JN5168/001 | IEEE 802.15.4 Wireless Microcontroller | 40-HVQFN, 6×6×0.85 mm, 0.5 mm pitch | 26+ | Request quote |
| K32W041Z | Wireless MCU | 40-HVQFN, 6×6×0.85 mm, 0.5 mm pitch | 26+ | Request quote |
| KW45B41Z83AFTBT | Bluetooth Wireless Microcontroller | 48-HVQFN wettable flanks, 7×7×0.85 mm, 0.5 mm pitch | 26+ | Request quote |
| LPC1766FBD100 | Arm Cortex-M MCU | 100-LQFP, 14×14 mm, 0.5 mm pitch | 25+ | Request quote |
| LPC1768FBD100 | Arm Cortex-M MCU | 100-LQFP, 14×14 mm, 0.5 mm pitch | 26+ | Request quote |
| LPC1788FBD208 | Arm Cortex-M MCU | 208-LQFP, 28×28 mm, 0.5 mm pitch | 25+ | Request quote |
| LPC54616J512BD100E | Arm Cortex-M MCU | 100-LQFP, 14×14 mm, 0.5 mm pitch | 25+ | Request quote |
| LPC54628J512ET180E | Arm Cortex-M MCU | 180-TFBGA | 25+ | Request quote |
| LPC5516JBD64E | Arm Cortex-M33 MCU | 64-HTQFP, 10×10 mm | 25+ | Request quote |
| LPC5528JBD100K | Arm Cortex-M33 MCU | 100-HTQFP, 14×14 mm | 25+ | Request quote |
| LPC5528JBD64K | Arm Cortex-M33 MCU | 64-HTQFP, 10×10 mm | 26+ | Request quote |
| LPC55S16JBD64E | Arm Cortex-M33 MCU | 64-HTQFP, 10×10 mm | 26+ | Request quote |
Before you buy
NXP sourcing checks
Check platform dependencies
Processor and MCU alternatives may change pinout, memory, peripherals, software and safety assumptions.
State automotive evidence needs
Include grade, date code, lot, label and requested traceability in the RFQ.
Automotive and connected embedded sourcing
Related engineering and sourcing guides
FAQ
NXP sourcing questions
What should an NXP automotive RFQ include?
Provide the complete orderable code, quantity, grade, target date code, packing and destination.
Can a related NXP MCU replace the BOM item?
Only after engineering confirms pinout, peripherals, memory, software and qualification requirements.
Can I submit NXP and other brands in one BOM?
Yes. The BOM form accepts mixed-brand lines for one sourcing review.
Send the exact MPN, quantity and delivery requirements.