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KMDP6001DA-B425

Brand: Samsung

The KMDP6001DA-B425 is a Samsung uMCP (UFS-based Multi-Chip Package) integrating 64 GB eMMC 5.1 NAND flash storage and 32 Gb (4 GB) LPDDR4X DRAM in a 254-ball FBGA package. Designed for entry-to-mid-tier smartphones, this single-package solution reduces board space and simplifies design while providing eMMC 5.1 sequential read speeds up to 250 MB/s and 4266 Mbps LPDDR4X DRAM bandwidth. The compact 11.5 × 13 mm footprint enables ultra-slim mobile form factors.

Stock & Date Code

Brand Part Number Qty D/C Note
Samsung KMDP6001DA-B425 3,250 26+ Samsung KMDP6001DA-B425 UFS Multi-Chip Package; confirm date code, lot and packing condition by RFQ.

Listed stock and date code are subject to final RFQ confirmation.

Technical Specifications

ParameterValue / Specification
Exact Part NumberKMDP6001DA-B425
ManufacturerSamsung Semiconductor
Product CategoryuMCP Memory
Memory TypeuMCP: UFS-based Multi-Chip Package combining eMMC 5.1 NAND flash + LPDDR4 xDRAM
Density / Capacity64 GB eMMC 5.1 NAND storage + 32 Gb (4 GB) LPDDR4 xRAM, single-package multi-die stack
Organization / Data WidtheMMC 5.1: 8-bit HS400 interface; LPDDR4 × : × 64 dual-channel DRAM; combined 254-ball unified pinout
Speed / Data RateeMMC 5.1: up to 330 MB/s sequential read (HS400); LPDDR4 × : 4266 Mbps per pin DRAM data rate
Supply VoltageeMMC: 3.3 V / 1.8 V; LPDDR4 × : 1.8 V VDD1 / 1.1 V VDD2 / 0.6 V VDDQ; shared power management
Operating Temperature-25 °C to +85 °C
Package / Case254-FBGA (11.5 × 13 mm, 0.5 mm pitch, SMT, Tray)

Key Features & Applications

  • Single-package uMCP: 64 GB eMMC 5.1 + 32 Gb LPDDR4X in 254-ball FBGA (11.5 × 13 mm, 0.5 mm pitch), minimizing board footprint for compact smartphone designs
  • eMMC 5.1 HS400 interface delivers up to 330 MB/s sequential read and 200 MB/s sequential write for responsive app loading and data access
  • LPDDR4X DRAM at 4266 Mbps x64 dual-channel with 0.6 V VDDQ, achieving balanced performance and power for entry-to-mid-tier mobile platforms
  • Integrated power management and unified command interface reduce BOM complexity and accelerate time-to-market for budget and mid-range smartphone OEMs
  • Temperature range -25 °C to +85 °C, JEDEC eMMC 5.1 and LPDDR4X compliant, RoHS, mass production
  • Targeted at entry-to-mid-tier smartphones, feature phones with smart capabilities, wearable companion devices, and cost-sensitive IoT hubs

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Listed stock is subject to final RFQ confirmation.

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Frequently Asked Questions

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