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LIMCHIP CO., LIMITED
Professional Electronic Components Distributor · HK · SZ · SG · Original Stock · Global Shipping
K3LK7K70BM-BGCB
Brand: Samsung
The K3LK7K70BM-BGCB is a Samsung 64 Gb (8 GB) LPDDR5 SDRAM organized as x64, delivering 6400 Mbps data rate for high-performance mobile and embedded applications. It operates with a multi-rail supply (1.8 V / 1.05 V / 0.9 V / 0.5 V) and supports adaptive refresh management and deep-sleep low-power modes. The low-voltage design extends battery life in smartphones, tablets, and AI edge devices. Housed in a 496-ball FBGA package, it is rated for -25 °C to +85 °C operating temperature.
Stock & Date Code
| Brand | Part Number | Qty | D/C | Note |
|---|---|---|---|---|
| Samsung | K3LK7K70BM-BGCB | 4,850 | 26+ | Samsung K3LK7K70BM-BGCB LPDDR5 Mobile DRAM; confirm date code, lot and packing condition by RFQ. |
Listed stock and date code are subject to final RFQ confirmation.
Memory Specifications
| Parameter | Value / Specification |
|---|---|
| Exact Part Number | K3LK7K70BM-BGCB |
| Manufacturer | Samsung Semiconductor |
| Product Category | LPDDR5 SDRAM |
| Memory Type | LPDDR5 SDRAM, 5th-generation low-power double data rate synchronous DRAM |
| Density / Capacity | 64 Gb (8 GB), single-die monolithic LPDDR5 device |
| Organization / Data Width | × 64 I/O configuration, quad-channel architecture with 16-bit per channel |
| Speed / Data Rate | 6400 Mbps per pin, 51.2 GB/s peak bandwidth at mmum data rate |
| Supply Voltage | 1.8 V (I/O), 1.05 V (VDDQ), 0.9 V (VDD2H), 0.5 V (VDD2L) multi-rail power domains |
| Operating Temperature | -25 °C to +85 °C |
| Package / Case | 496-FBGA (14 × 14 mm, 0.5 mm pitch, SMT, Tray) |
Memory Features & Applications
- 64 Gb density organized as x64 with quad-channel architecture, delivering 6400 Mbps data rate and 51.2 GB/s peak memory bandwidth
- Multi-rail power architecture (1.8 V / 1.05 V / 0.9 V / 0.5 V) with adaptive refresh management and deep-sleep low-power modes for mobile battery efficiency
- On-die ECC with write and read CRC for data integrity, plus per-bank refresh and temperature-compensated self-refresh for reliable operation
- Dynamic voltage-frequency scaling (DVFS) support for power-optimized performance across active, standby, and deep-sleep states
- FBGA-496 package (14 × 14 mm, 0.5 mm ball pitch), -25 °C to +85 °C operating range, mass production status, RoHS compliant
- Ideal for flagship smartphones, high-end tablets, AI edge inference, AR/VR headsets, and automotive infotainment systems requiring high bandwidth in low-power envelope
Need Price & Availability for K3LK7K70BM-BGCB?
LimChip can confirm current price, date code, packing condition, lot traceability and shipment schedule for K3LK7K70BM-BGCB.
Listed stock is subject to final RFQ confirmation.
For faster RFQ confirmation, please include:
- Required quantity
- Target date code
- Package / case requirement
- Delivery country
- Company name and contact person
- Target price if available
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Quality, Shipping & Payment
Commercial and shipment details for K3LK7K70BM-BGCB are confirmed with the formal quotation.
Shipping
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Payment
Payment method, currency and trade terms are confirmed in the formal quotation or proforma invoice. Contact our sales team for the options available for your order.
Frequently Asked Questions
Is K3LK7K70BM-BGCB available from LimChip?
LimChip can confirm current availability, price, quantity, date code and lead time for K3LK7K70BM-BGCB by RFQ.
What should buyers check before ordering K3LK7K70BM-BGCB?
Buyers should check memory density, speed suffix, package, temperature grade and batch traceability for K3LK7K70BM-BGCB, together with live stock and traceable supply.
How do I request a quote for K3LK7K70BM-BGCB?
Use the RFQ button and include required quantity, target date code, package/case requirement, delivery country, company name and contact details.