LIMCHIP CO., LIMITED

Professional Electronic Components Distributor · HK · SZ · SG · Original Stock · Global Shipping

Home > All Products > Memory ICs > KM8F9001JM-B813

KM8F9001JM-B813

Check Stock

The KM8F9001JM-B813 is a Samsung eMCP (embedded Multi-Chip Package) integrating 256 GB UFS 3.1 NAND flash storage and 96 Gb (12 GB) LPDDR4X DRAM in a single 254-ball FBGA package. This single-package memory + storage solution simplifies PCB layout for mid-range smartphones and tablets, combining high-speed UFS sequential read performance with low-power LPDDR4X DRAM for application multitasking. Rated for -25 °C to +85 °C, it enables slim, power-efficient mobile device designs.

Stock & Date Code

Brand	Part Number	Qty	D/C	Note
Samsung	KM8F9001JM-B813	5,200	26+	Samsung KM8F9001JM-B813 Embedded Multi-Chip Package; confirm date code, lot and packing condition by RFQ.

Listed stock and date code are subject to final RFQ confirmation.

MCU / Processor Specifications

Parameter	Value / Specification
Exact Part Number	KM8F9001JM-B813
Manufacturer	Samsung Semiconductor
Product Category	eMCP Memory
Memory Type	eMCP: Embedded Multi-Chip Package combining UFS 3.1 NAND flash + LPDDR4 xDRAM in a single package
Density / Capacity	256 GB UFS 3.1 NAND storage + 96 Gb (12 GB) LPDDR4 xRAM, single-package multi-die stack
Organization / Data Width	UFS: 2-lane HS-Gear4, LPDDR4 × : × 64 dual-channel DRAM interface, separate command/data paths per die
Speed / Data Rate	UFS 3.1: up to 2.9 GB/s sequential read, 1.2 GB/s sequential write; LPDDR4 × : 4266 Mbps DRAM data rate
Supply Voltage	UFS: 2.5 V / 1.8 V / 1.2 V; LPDDR4 × : 1.8 V VDD1 / 1.1 V VDD2 / 0.6 V VDDQ; shared VDDI
Operating Temperature	-25 °C to +85 °C
Package / Case	254-FBGA (11.5 × 13 mm, 0.5 mm pitch, SMT, Tray)

Embedded Processor Features & Applications

Single-package integration: 256 GB UFS 3.1 NAND + 96 Gb LPDDR4X in 254-ball FBGA (11.5 × 13 mm), reducing PCB area versus discrete solutions
UFS 3.1 with 2-lane HS-Gear4 delivering up to 2.9 GB/s sequential read and 1.2 GB/s sequential write for fast boot and app launch
LPDDR4X DRAM at 4266 Mbps x64 dual-channel with 0.6 V VDDQ for 15% power savings versus LPDDR4, supporting aggressive mobile power budgets
Shared command and power management interface simplifies host controller design and reduces BOM for mid-range smartphone and tablet platforms
Temperature range -25 °C to +85 °C, JEDEC UFS 3.1 and LPDDR4X compliant, RoHS, mass production
Ideal for mid-range smartphones, Android tablets, and portable embedded computing devices needing integrated storage and DRAM in compact form factor

Why Embedded Teams Source KM8F9001JM-B813

KM8F9001JM-B813 is best treated as a sourcing-specific line item, not a generic replacement, because density, speed suffix, temperature grade and batch consistency can affect approval. 5,200 pcs is listed as project-level spot stock; LimChip should confirm live allocation, batch condition and lead time before purchase. Suited to buyers needing the exact KM8F9001JM-B813 ordering code — the Embedded Multi-Chip Package in 254-FBGA (11.5 × 13 mm, 0.5 mm pitch, SMT, Tray) — rather than a generic part.

LimChip can confirm current price, date code, packing condition, lot traceability and shipment schedule for KM8F9001JM-B813.

MCU / Processor Sourcing Checklist

Confirm exact suffix, package, memory option and temperature grade.
Check firmware, boot mode, peripheral compatibility and lifecycle status.
Verify quantity, traceability and 26+ for production or repair demand.

KM8F9001JM-B813 (Embedded Multi-Chip Package, tray) is offered from stock; live quantity and lot split are confirmed by RFQ.

Need Price & Availability for KM8F9001JM-B813?

LimChip can confirm current price, date code, packing condition, lot traceability and shipment schedule for KM8F9001JM-B813.

Listed stock is subject to final RFQ confirmation.

For faster RFQ confirmation, please include:

Required quantity
Target date code
Package / case requirement
Delivery country
Company name and contact person
Target price if available

Prefer email? Send this RFQ via email instead.

Quality, Shipping & Payment

Commercial and shipment details for KM8F9001JM-B813 are confirmed with the formal quotation.

Quality Confirmation

Date code, batch, package, label and marking details are checked before shipment. Inspection photos and third-party inspection support are available when required.

Shipping

LimChip supports worldwide delivery through established logistics providers. Carrier, lead time, tracking and buyer-appointed freight-forwarder requirements are confirmed by our sales team.

Payment

Payment method, currency and trade terms are confirmed in the formal quotation or proforma invoice. Contact our sales team for the options available for your order.

Frequently Asked Questions

Is KM8F9001JM-B813 available from LimChip?

LimChip can confirm current availability, price, quantity, date code and lead time for KM8F9001JM-B813 by RFQ.

What should buyers check before ordering KM8F9001JM-B813?

Buyers should check exact suffix, package, memory option, firmware compatibility and lifecycle status for KM8F9001JM-B813, together with live stock and traceable supply.

How do I request a quote for KM8F9001JM-B813?

Use the RFQ button and include required quantity, target date code, package/case requirement, delivery country, company name and contact details.