LimChip lists K4ZAF325BM-HC14 for sourcing teams that need DDR, LPDDR and industrial memory platforms without changing the approved BOM. Procurement checks normally cover density, speed suffix, temperature grade and batch consistency, plus RFQ-confirmed package/case and traceable supply.
| Parameter | Value / Specification |
|---|---|
| Exact Part Number | K4ZAF325BM-HC14 |
| Manufacturer | Samsung Electronics |
| Product Category | Memory IC |
| Sourcing Focus | DDR, LPDDR and industrial memory platforms |
| BOM / RFQ Checks | density, speed suffix, temperature grade and batch consistency |
| Package / Case | Confirm against buyer BOM |
Buyers normally source K4ZAF325BM-HC14 when an existing BOM requires the same manufacturer suffix for DDR, LPDDR and industrial memory platforms. 2,800 pcs is listed as project-level spot stock; LimChip should confirm live allocation, batch condition and lead time before purchase. Useful for sourcing teams that need exact manufacturer suffix matching for Memory IC demand.
LimChip can confirm current price, quantity, date code, batch condition and shipping schedule by RFQ.
2,800 listed as spot stock for K4ZAF325BM-HC14; confirm live allocation, price and shipment schedule by RFQ.
LimChip can confirm current availability, price, quantity, date code and lead time for K4ZAF325BM-HC14 by RFQ.
Buyers should check memory density, speed suffix, package, temperature grade and batch traceability for K4ZAF325BM-HC14, together with live stock and traceable supply.
Use the RFQ button and include required quantity, target date code, company name and contact details.
LimChip can confirm current price, quantity, date code, batch condition and shipping schedule by RFQ.
| Brand | Part Number | Qty (PCS) | D/C | Note |
|---|---|---|---|---|
| Samsung | K4ZAF325BM-HC14 | 2,800 | 26+ | Memory IC stock for RFQ and production sourcing |