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K4ZAF325BM-HC14

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The K4ZAF325BM-HC14 is a Samsung 16 Gb (2 GB) GDDR6 graphics SDRAM organized as 512 32, delivering 14.0 Gbps per pin for 56 GB/s single-device bandwidth. Designed for high-end discrete GPUs, AI accelerator cards, game consoles, and HPC platforms, its 1.35 V supply reduces power consumption compared to prior GDDR5 generations. The 180-ball FBGA package operates from 0 °C to +95 °C, with a 16K/32ms refresh cycle for sustained graphics and compute throughput.

Stock & Date Code

Brand	Part Number	Qty	D/C	Note
Samsung	K4ZAF325BM-HC14	2,800	26+	Samsung K4ZAF325BM-HC14 Graphics DRAM; confirm date code, lot and packing condition by RFQ.

Listed stock and date code are subject to final RFQ confirmation.

Memory Specifications

Parameter	Value / Specification
Exact Part Number	K4ZAF325BM-HC14
Manufacturer	Samsung Semiconductor
Product Category	GDDR6 SDRAM
Memory Type	GDDR6 SDRAM, graphics double data rate synchronous DRAM, 6th generation
Density / Capacity	16 Gb (2 GB), single-die monolithic GDDR6 device
Organization / Data Width	512 32 (32-bit I/O), 16 bank 32-bit per access with PAM4 signaling
Speed / Data Rate	14.0 Gbps per pin, 56 GB/s peak single-device bandwidth over 32-bit bus
Supply Voltage	1.35 V nominal core and I/O supply, 15% lower power than GDDR5 at equivalent bandwidth
Operating Temperature	0 °C to +95 °C (TC), 16K refresh / 32 ms cycle
Package / Case	180-FBGA (14 × 12 mm, 0.65 mm pitch, SMT, Tray)

Memory Features & Applications

16 Gb density organized as 512 32 with 16-bank architecture, delivering 14.0 Gbps per pin and 56 GB/s single-device bandwidth via PAM4 signaling
1.35 V low-voltage operation reduces power by ~15% versus GDDR5 while doubling per-pin bandwidth for energy-efficient high-performance graphics and compute
180-ball FBGA package (14 × 12 mm, 0.65 mm pitch), 0 °C to +95 °C operating range, 16K/32ms refresh for sustained throughput in GPU and accelerator workloads
Error detection and correction support with internal write/read CRC for data integrity at 14 Gbps signaling rates
Pseudo-channel mode splits 32-bit bus into two independent 16-bit channels for concurrent read/write operations, maximizing memory utilization in graphics pipelines
Targeting discrete GPUs (NVIDIA, AMD), AI training/inference accelerators, game consoles, and HPC compute platforms requiring high-bandwidth graphics memory

Why Buyers Source K4ZAF325BM-HC14

Buyers normally source K4ZAF325BM-HC14 when an existing BOM requires the same manufacturer suffix for DDR, LPDDR and industrial memory platforms. 2,800 pcs is listed as project-level spot stock; LimChip should confirm live allocation, batch condition and lead time before purchase. Suited to buyers needing the exact K4ZAF325BM-HC14 ordering code — the Graphics DRAM in 180-FBGA (14 × 12 mm, 0.65 mm pitch, SMT, Tray) — rather than a generic part.

LimChip can confirm current price, date code, packing condition, lot traceability and shipment schedule for K4ZAF325BM-HC14.

Memory IC Sourcing Checklist

Confirm density, speed grade, temperature option and exact suffix.
Match 180-FBGA (14 × 12 mm, 0.65 mm pitch, SMT, Tray) and approved Micron, Samsung or memory vendor source requirements when applicable.
Check batch consistency, quantity and 26+ for production builds.

K4ZAF325BM-HC14 (Graphics DRAM, tray) is offered from stock; live quantity and lot split are confirmed by RFQ.

Need Price & Availability for K4ZAF325BM-HC14?

LimChip can confirm current price, date code, packing condition, lot traceability and shipment schedule for K4ZAF325BM-HC14.

Listed stock is subject to final RFQ confirmation.

For faster RFQ confirmation, please include:

Required quantity
Target date code
Package / case requirement
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Quality, Shipping & Payment

Commercial and shipment details for K4ZAF325BM-HC14 are confirmed with the formal quotation.

Quality Confirmation

Date code, batch, package, label and marking details are checked before shipment. Inspection photos and third-party inspection support are available when required.

Shipping

LimChip supports worldwide delivery through established logistics providers. Carrier, lead time, tracking and buyer-appointed freight-forwarder requirements are confirmed by our sales team.

Payment

Payment method, currency and trade terms are confirmed in the formal quotation or proforma invoice. Contact our sales team for the options available for your order.

Frequently Asked Questions

Is K4ZAF325BM-HC14 available from LimChip?

LimChip can confirm current availability, price, quantity, date code and lead time for K4ZAF325BM-HC14 by RFQ.

What should buyers check before ordering K4ZAF325BM-HC14?

Buyers should check memory density, speed suffix, package, temperature grade and batch traceability for K4ZAF325BM-HC14, together with live stock and traceable supply.

How do I request a quote for K4ZAF325BM-HC14?

Use the RFQ button and include required quantity, target date code, package/case requirement, delivery country, company name and contact details.