Quality Confirmation
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LIMCHIP CO., LIMITED
Professional Electronic Components Distributor · HK · SZ · SG · Original Stock · Global Shipping
GDP2BFLM-WB
Brand: GigaDevice
GDP2BFLM-WB is a GigaDevice 4 Gb DDR3L SDRAM organized 256 16 at 1866 Mbps in a 96-ball FBGA package rated for industrial temperature (-40 °C to +95 °C). Dual 1.35 V / 1.5 V support ensures compatibility with both DDR3L and legacy DDR3 platforms. LimChip stocks this part; confirm date code and tray condition by RFQ.
Stock & Date Code
| Brand | Part Number | Qty | D/C | Note |
|---|---|---|---|---|
| GigaDevice | GDP2BFLM-WB | 19,800 | 25+ | GigaDevice GDP2BFLM-WB 4Gb DDR3L SDRAM, x16, 1866Mbps, 1.35V/1.5V, 96-ball FBGA, Industrial; confirm date code, lot and packing condition by RFQ. |
Listed stock and date code are subject to final RFQ confirmation.
Memory Specifications
| Parameter | Value / Specification |
|---|---|
| Memory Type | DDR3L SDRAM |
| Density / Capacity | 4 Gb DDR3L SDRAM with x16 organization and 1866 Mbps data rate for cost-optimized embedded memory subsystems |
| Organization / Data Width | 256 16 ( × 16) |
| Speed / Data Rate | 1866 Mbps (DDR3-1866) |
| Supply Voltage (VDD/VDDQ) | 1.35 V (DDR3L) / 1.5 V (DDR3 compatible) |
| CAS Latency | CL13 |
| Number of Banks | 4 Gb DDR3L SDRAM with x16 organization and 1866 Mbps data rate for cost-optimized embedded memory subsystems |
| Refresh | 8K / 64 ms auto-refresh |
| Operating Temperature | -40 °C to +95 °C (industrial) |
| Package / Case | 96-FBGA (96-ball Fine-Pitch BGA) |
Memory Features & Applications
- 4 Gb DDR3L SDRAM with x16 organization and 1866 Mbps data rate for cost-optimized embedded memory subsystems
- Dual-voltage 1.35 V / 1.5 V operation — backward-compatible with DDR3 sockets while delivering DDR3L power savings
- Industrial temperature range -40 °C to +95 °C for outdoor, automotive and rugged embedded deployments
- 8-bank architecture with programmable CAS latency and burst length for flexible memory controller configuration
- 96-ball FBGA package compatible with JEDEC-standard DDR3/DDR3L PCB layout and signal integrity guidelines
- GigaDevice niche DRAM portfolio provides second-source and supply-chain diversification for x16 DDR3L demand
Need Price & Availability for GDP2BFLM-WB?
LimChip can confirm current price, date code, packing condition, lot traceability and shipment schedule for GDP2BFLM-WB.
Listed stock is subject to final RFQ confirmation.
For faster RFQ confirmation, please include:
- Required quantity
- Target date code
- Package / case requirement
- Delivery country
- Company name and contact person
- Target price if available
Prefer email? Send this RFQ via email instead.
Quality, Shipping & Payment
Commercial and shipment details for GDP2BFLM-WB are confirmed with the formal quotation.
Shipping
LimChip supports worldwide delivery through established logistics providers. Carrier, lead time, tracking and buyer-appointed freight-forwarder requirements are confirmed by our sales team.
Payment
Payment method, currency and trade terms are confirmed in the formal quotation or proforma invoice. Contact our sales team for the options available for your order.
Frequently Asked Questions
Is GDP2BFLM-WB available from LimChip?
LimChip can confirm current availability, price, quantity, date code and lead time for GDP2BFLM-WB by RFQ.
What should buyers check before ordering GDP2BFLM-WB?
Buyers should check memory density, speed suffix, package, temperature grade and batch traceability for GDP2BFLM-WB, together with live stock and traceable supply.
How do I request a quote for GDP2BFLM-WB?
Use the RFQ button and include required quantity, target date code, package/case requirement, delivery country, company name and contact details.