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Brand: Samsung

K4F8E3S4HD-GHCL

LPDDR4 SDRAM

K4F8E3S4HD-GHCL is a Samsung 8 Gb LPDDR4 SDRAM organized x32 and rated at 4266 Mbps. It runs from a 1.8 V I/O rail with a 1.1 V core/VDDQ supply, supporting low-power mobile and embedded memory subsystems in a 200-FBGA package across the -40 °C to +105 °C range.

ManufacturerSamsung Electronics
Package200-FBGA (200-ball Fine-Pitch BGA)
SeriesSamsung LPDDR4

Memory Specifications

ParameterValue / Specification
Memory TypeLPDDR4 SDRAM
Density / Capacity8 Gb (1 GB) LPDDR4 SDRAM
Organization / Data Widthx32 (32-bit data bus)
Speed / Data Rate4266 Mbps (LPDDR4-4266)
InterfaceLPDDR4 command/address-clocked, 16n prefetch
Supply Voltage1.8 V (VPP / I/O) and 1.1 V (VDD1 core / VDDQ)
Operating Temperature-40 °C to +105 °C
Package / Case200-FBGA (200-ball Fine-Pitch BGA)
LifecycleManufacturer-discontinued per Samsung page; distributor stock confirmed by RFQ

Memory Features & Applications

  • 8 Gb LPDDR4 delivers mobile-grade low-power DRAM for embedded and compute
  • x32 organization supports a 32-bit data bus with 16n prefetch
  • 4266 Mbps data rate sustains LPDDR4-4266 bandwidth
  • 1.8 V I/O and 1.1 V core trim active power versus DDR-class memory
  • 200-FBGA package fits space-limited embedded and mobile boards
  • -40 °C to +105 °C range spans industrial and automotive-adjacent use
  • Low-power LPDDR4 topology targets battery and thermally constrained systems

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Frequently Asked Questions

Is K4F8E3S4HD-GHCL available from LimChip?

LimChip can confirm current availability, price, quantity, date code and lead time for K4F8E3S4HD-GHCL by RFQ.

What should buyers check before ordering K4F8E3S4HD-GHCL?

Buyers should check memory density, speed suffix, package, temperature grade and batch traceability for K4F8E3S4HD-GHCL, together with live stock and traceable supply.

How do I request a quote for K4F8E3S4HD-GHCL?

Use the RFQ button and include required quantity, target date code, package/case requirement, delivery country, company name and contact details.