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X6425E

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Intel Atom x6425E (part number X6425E) is the highest-performance quad-core embedded processor in the Elkhart Lake x6000E series, built on 10 nm lithography. It features four Tremont-class x86-64 cores without Hyper-Threading, clocked at 2.00 GHz base with a 3.00 GHz burst via Intel Speed Shift Technology, and carries a 1.5 MB L2 cache within a 12 W TDP envelope. The processor supports up to 32 GB of LPDDR4/x at 3733 MT/s (4×32 configuration) or DDR4 at 3200 MT/s (2×64) with In-Band ECC across four memory channels providing 59.7 GB/s bandwidth, and integrates Intel UHD Graphics with 32 execution units — double the GPU resources of the J6412/J6413 — at 500 MHz base with 750 MHz burst driving three independent 4K 60 Hz displays. I/O includes eight PCIe 3.0 lanes with flexible bifurcation, four USB 2.0/3.0/3.1 ports, two SATA 6.0 Gb/s ports, three integrated 2.5GbE MACs, GPIO and UART. The X6425E is supplied in a 35 × 24 mm FCBGA1493 package, operates from -40 °C to 85 °C with a 105 °C Tjunction, and includes Intel Boot Guard, OS Guard, Secure Key, AES-NI, VT-x/VT-d/EPT and the Gaussian & Neural Accelerator 1.0. Launched Q1 2021, it is qualified for embedded broad market extended temperature use and delivers the best single-thread burst and GPU throughput in the Elkhart Lake x6000E family.

Stock & Date Code

Brand	Part Number	Qty	D/C	Note
Intel	X6425E	1,920	26+	Intel X6425E (Atom x6425E); confirm date code, lot and packing condition by RFQ.

Listed stock and date code are subject to final RFQ confirmation.

MCU / Processor Specifications

Parameter	Value / Specification
Core / Architecture	4 cores, 4 threads, no Hyper-Threading; Elkhart Lake microarchitecture (Tremont), 64-bit instruction set; Intel Atom Processoeries
Clock Frequency	Base 2.00 GHz, burst 3.00 GHz; Intel Speed Shift Technology; 10 nm lithography
Memory	32 GB mPDDR4/ xp to 3733 MT/s (4×32 config) or DDR4 up to 3200 MT/s (2×64) with In-Band ECC; 4 memory channels; 59.7 GB/s bandwidth
Interfaces	PCIe 3.0 (8 lanes, 1×4/2×2/1×2+2×1 config); 4× USB 2.0/3.0/3.1; 2× SATA 6.0 Gb/s; 3× 2.5GbE LAN; GPIO; UART; eDP/DP/HDMI/MIPI-DSI display
Package / Case	FCBGA1493, 35 × 24 mm, tray (OEM)
Graphics (GPU)	Intel UHD Graphics (10th Gen), 32 cution units; 500 MHz base / 750 MHz burst; 3× display support; 4K at 60 Hz via DP/eDP; Direc , OpenGL, OpenCL, Quick Sync Video
Thermal / Environmental	TDP 12 W; Tjunction 105 °C; operating -40 °C to 85 °C (embedded broad market ended temp); 1 CPU mer board; Intel Gaussian & Neural Accelerator 1.0
Product Collection	Intel Atom Processoeries (Elkhart Lake); launched Q1 2021; embedded options available; embedded broad market ended temp qualified
Security / Reliability	Secure Boot, Intel Secure Key, AES-NI, cute Disable Bit, OS Guard, Boot Guard, VT- × , VT-d, EPT; no Trusted cution Technology
Lifecycle	Launched; embedded options available; Q1 2021 introduction; embedded broad market ended temperature range

Embedded Processor Features & Applications

X6425E (Intel Atom x6425E) delivers four Tremont-class Elkhart Lake cores at up to 3.00 GHz burst with 1.5 MB L2 cache, making it the highest-performance Atom x6000E SKU for embedded computing with 12 W TDP.
Doubled GPU execution units — 32 EU at up to 750 MHz — provide 2× the graphics throughput of the J6412/J6413 (16 EU), targeting multi-display digital signage, medical imaging and advanced HMI applications.
In-Band ECC memory protection across LPDDR4/x up to 3733 MT/s and DDR4 up to 3200 MT/s with 32 GB maximum capacity and 59.7 GB/s bandwidth supports data integrity for medical, transportation and industrial control.
Three integrated 2.5GbE MACs, eight PCIe 3.0 lanes with flexible bifurcation, four USB 2.0/3.0/3.1 ports and two SATA 6.0 Gb/s ports provide comprehensive I/O for network-intensive embedded and edge computing platforms.
Intel Speed Shift Technology with 3.00 GHz burst enables responsive single-thread workloads while maintaining 12 W TDP for fanless operation across the -40 °C to 85 °C embedded broad market extended temperature range.
Hardware-rooted security with Boot Guard, OS Guard, Intel Secure Key and AES-NI encryption paired with the Gaussian & Neural Accelerator 1.0 provides platform trust and low-power AI inference for connected edge applications.

Why Embedded Teams Source X6425E

Buyers normally source X6425E when an existing BOM requires the same manufacturer suffix for embedded control and processor sourcing. For overseas buyers, the important confirmation points are stock reality, traceability, packing condition and shipment window. Suited to buyers needing the exact X6425E ordering code — the Atom x6425E with 32 EU GPU in FCBGA1493 — rather than a substitute embedded processor.

LimChip can confirm current price, date code, packing condition, lot traceability and shipment schedule for X6425E.

MCU / Processor Sourcing Checklist

Confirm exact suffix, package, memory option and temperature grade.
Check firmware, boot mode, peripheral compatibility and lifecycle status.
Verify quantity, traceability and 26+ for production or repair demand.

X6425E (Intel Atom x6425E, FCBGA1493, tray) is offered from stock; live quantity and lot split are confirmed by RFQ.

Need Price & Availability for X6425E?

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Listed stock is subject to final RFQ confirmation.

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Commercial and shipment details for X6425E are confirmed with the formal quotation.

Quality Confirmation

Date code, batch, package, label and marking details are checked before shipment. Inspection photos and third-party inspection support are available when required.

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Frequently Asked Questions

Is X6425E available from LimChip?

LimChip can confirm current availability, price, quantity, date code and lead time for X6425E by RFQ.

What should buyers check before ordering X6425E?

Buyers should check exact suffix, package, memory option, firmware compatibility and lifecycle status for X6425E, together with live stock and traceable supply.

How do I request a quote for X6425E?

Use the RFQ button and include required quantity, target date code, package/case requirement, delivery country, company name and contact details.