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X6414RE

Brand: Intel

Intel Atom x6414RE (part number X6414RE) is a real-time enhanced quad-core embedded processor from the Elkhart Lake platform built on 10 nm lithography. It features four Tremont-class x86-64 cores at a fixed 1.50 GHz — with no burst — to deliver deterministic execution timing via Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN) within a 9 W TDP envelope. The processor supports up to 32 GB of LPDDR4/x at 3200 MT/s (4×32, 16 GB max) or DDR4 at 3200 MT/s (2×64, 32 GB max) with In-Band ECC across four memory channels providing 51.2 GB/s bandwidth, and integrates Intel UHD Graphics with 16 execution units at 400 MHz driving three independent 4K 60 Hz displays. I/O includes eight PCIe 3.0 lanes with flexible bifurcation, four USB 2.0/3.0/3.1 ports, two SATA 6.0 Gb/s ports, three TSN-capable 2.5GbE MACs, GPIO and UART. The X6414RE is supplied in a 35 × 24 mm FCBGA1493 package, operates from -40 °C to 85 °C with a 110 °C Tjunction, and includes Intel Boot Guard, OS Guard, Secure Key, AES-NI, VT-x/VT-d/EPT and the Gaussian & Neural Accelerator 1.0. Launched Q1 2021, it is qualified for industrial extended temperature use and is the real-time deterministic variant of the Elkhart Lake x6000E series.

Stock & Date Code

Brand Part Number Qty D/C Note
Intel X6414RE 1,440 25+ Intel X6414RE (Atom x6414RE); confirm date code, lot and packing condition by RFQ.

Listed stock and date code are subject to final RFQ confirmation.

MCU / Processor Specifications

ParameterValue / Specification
Core / Architecture4 cores, 4 threads, no Hyper-Threading; Elkhart Lake microarchitecture (Tremont), 64-bit instruction set; Intel Atom Processoeries (real-time enhanced variant)
Clock FrequencyBase 1.50 GHz, no burst frequency (fd-clock deterministic operation); Intel Speed Shift Technology; 10 nm lithography
Memory32 GB mPDDR4/ xp to 3200 MT/s (4×32 config, 16 GB m ) or DDR4 up to 3200 MT/s (2×64, 32 GB m ) with In-Band ECC; 4 memory channels; 51.2 GB/s bandwidth
InterfacesPCIe 3.0 (8 lanes, 1×4/2×2/1×2+2×1 config); 4× USB 2.0/3.0/3.1; 2× SATA 6.0 Gb/s; 3× 2.5GbE LAN (TCC/TSN-enabled); GPIO; UART; eDP/DP/HDMI/MIPI-DSI display
Package / CaseFCBGA1493, 35 × 24 mm, tray (OEM)
Graphics (GPU)Intel UHD Graphics (10th Gen), 16 cution units; 400 MHz base (no burst); 3× display support; 4K at 60 Hz via DP/eDP; Direc , OpenGL, OpenCL, Quick Sync Video
Thermal / EnvironmentalTDP 9 W; Tjunction 110 °C; operating -40 °C to 85 °C (industrial ended temp); 1 CPU mer board; Intel TCC and TSN for real-time workloads
Product CollectionIntel Atom Processoeries (Elkhart Lake, real-time enhanced); launched Q1 2021; embedded options available; industrial ended temp qualified
Security / ReliabilitySecure Boot, Intel Secure Key, AES-NI, cute Disable Bit, OS Guard, Boot Guard, VT- × , VT-d, EPT; no Trusted cution Technology
LifecycleLaunched; embedded options available; Q1 2021 introduction; industrial ended temperature range; Intel TCC + TSN for deterministic real-time

Embedded Processor Features & Applications

  • X6414RE (Intel Atom x6414RE) delivers four Tremont-class Elkhart Lake cores at a fixed 1.50 GHz with Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN) for deterministic real-time embedded control and industrial automation.
  • Fixed-clock operation without burst eliminates execution-time jitter, enabling hard real-time control loops in PLC, motion control and CNC applications where deterministic latency is critical.
  • In-Band ECC memory protection across LPDDR4/x up to 3200 MT/s and DDR4 up to 3200 MT/s with 32 GB maximum capacity and 51.2 GB/s bandwidth supports safety-critical data integrity in industrial and transportation systems.
  • Three integrated 2.5GbE MACs with TSN enable synchronized multi-port networking for distributed real-time control, eliminating the need for external Ethernet controllers and reducing BOM cost for industrial gateways.
  • Intel UHD Graphics with 16 execution units at 400 MHz drives three independent 4K 60 Hz displays for HMI and operator panel applications in factory-floor and process-control environments.
  • Industrial extended temperature from -40 °C to 85 °C with 110 °C Tjunction rating and 9 W TDP enables fanless sealed-enclosure deployment in harsh outdoor, transportation and heavy-industrial environments.

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