Industry Insights
Practical analysis and guides on component selection, system design, and sourcing decisions for engineering and procurement teams.
Infineon 800V HVDC AI Server Power Architecture Explained for Component Buyers
A procurement-focused guide to Infineon's 800V HVDC AI server power architecture, covering 48V limits, three DC/DC routes, GaN and HSC topologies, VPD modules and…
Optical Transceivers: Global Supply Chain and Sourcing Guide for Buyers
A practical guide to optical transceivers for procurement teams, covering how they work, the global supply chain, key vendors, AI demand, the CPO roadmap and sourcing…
XC7Z045 Zynq-7000 SoC: Architecture, Applications and Sourcing Notes for Embedded Buyers
A practical guide to the AMD Xilinx XC7Z045 Zynq-7000 SoC covering its ARM plus FPGA architecture, common applications, package decoding and supply-chain notes for…
Google Revisits Five Generations of TPU: Why AI ASICs Still Have Room to Run
What Google's TPU v2-to-Ironwood paper reveals about AI ASIC longevity, HBM, optical interconnects, resilience, power efficiency and the wider component supply chain.
Inside a Xiaomi SU7 T-Box: 5G, Automotive Ethernet, Backup Power and Component Sourcing
An engineering and sourcing review of a Xiaomi SU7 telematics control unit teardown, covering Quectel AG571Q, automotive MCU, Ethernet, CAN FD, memory, audio and…
NOR, NAND, DRAM, DDR, HBM and SRAM Explained: A Practical Memory Glossary
A plain-English guide to volatile and non-volatile memory: SRAM, DRAM, DDR, LPDDR, GDDR, HBM, NAND Flash, NOR Flash and where MCUs fit.
On-Device AI Is the Next Deployment Wave: China-Based Edge AI Chips and Sourcing Priorities
A practical guide to on-device AI, China-based edge AI platforms, deployment tradeoffs and the processor, memory, power and lifecycle checks engineers and buyers…
Space and Defense FPGA Comparison: RTG4 vs AMD XQR vs Pango Titan vs Fudan JFM7—and Where Teledyne Fits
An evidence-based comparison of space and high-reliability FPGA routes, covering radiation data, logic resources, qualification, toolchains and sourcing risk.
China-Based FPGA Vendors as Alternative Platforms: Four Engineering and Sourcing Comparisons
Evaluate four China-based FPGA vendor groups as potentially lower-cost alternative platforms for engineers and component sourcing teams.
How to Identify Counterfeit ICs Before Purchase
A practical inspection guide for buyers checking IC authenticity, including label review, surface marks, laser marking, pin condition, package edge, date code and RFQ…
IC Package Types Explained: A Buyer’s Guide to DIP, SOIC, QFP, QFN, BGA and CSP
A practical IC package guide for component buyers, covering common package types, sourcing checks, part-number suffix risks, packaging condition and RFQ verification…
Original, Refurbished, Remarked and Pulled ICs: What Buyers Should Know
A buyer-focused guide explaining factory sealed stock, opened original packaging, loose new parts, refurbished ICs, remarked devices and used-pull components.