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Brand: AMD Xilinx

XCKU3P-2FFVA676I

FPGA

XCKU3P-2FFVA676I is an AMD Xilinx Kintex UltraScale+ FPGA built on TSMC 16 nm FinFET process, with 355,950 logic cells (20,340 CLBs), 12.7 Mb block RAM plus 4.7 Mb distributed RAM, 1,368 DSP slices and 16 GTY transceivers up to 16.375 Gbps. This -2 speed-grade, industrial-temperature device ships in the 676-ball FCBGA (FFVA676), 27 × 27 mm, 1.0 mm pitch.

ManufacturerAMD Xilinx
Package676-ball FCBGA (FFVA676), 27 × 27 mm, 1.0 mm pitch
SeriesKintex UltraScale+

Programmable Logic Specifications

ParameterValue / Specification
Family / ArchitectureKintex UltraScale+, TSMC 16 nm FinFET
Logic Elements355,950 logic cells (20,340 CLBs)
DSP Slices1,368 DSP slices (27×18 multipliers with pre-adders)
Embedded Memory12.7 Mb block RAM + 4.7 Mb distributed RAM
Transceivers16 × GTY up to 16.375 Gbps (NRZ)
Maximum I/O256 user I/O pins
Core Voltage0.85 V (0.825 V to 0.876 V)
Speed Grade-2 (1 = fastest)
Temperature GradeIndustrial (TJ = -40 °C to +100 °C)
Package / Case676-ball FCBGA (FFVA676), 27 × 27 mm, 1.0 mm pitch
Package / Orderable Variant676-ball FCBGA (FFVA676), 27 × 27 mm, 1.0 mm pitch; exact suffix XCKU3P-2FFVA676I

FPGA / CPLD Features & Applications

  • Kintex UltraScale+ (XCKU3P): 355,950 logic cells (20,340 CLBs) on TSMC 16 nm FinFET
  • 1,368 DSP slices for high-throughput DSP, FFT and signal-processing pipelines
  • 12.7 Mb block RAM plus 4.7 Mb distributed RAM for on-chip buffering
  • 16 GTY transceivers up to 16.375 Gbps for PCIe, 10G/25G Ethernet and JESD204B
  • 256 user I/O in the 676-ball FCBGA (FFVA676), 27 × 27 mm, 1.0 mm pitch
  • -2 speed grade; industrial temperature grade (-40 °C to +100 °C)
  • Mid-range UltraScale+ balance of logic, DSP and high-speed serial connectivity

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