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LIMCHIP CO., LIMITED
Professional Electronic Components Distributor · HK · SZ · SG · Original Stock · Global Shipping
H9JCNNNBK3MLYR-N6E
Brand: SK hynix
H9JCNNNBK3MLYR-N6E is an SK hynix 16 Gb LPDDR5-6400 SDRAM organized 512M×32 in a 315-ball TFBGA package. With dual-channel architecture and 6400 Mbps data rate, it serves high-bandwidth, power-sensitive mobile and embedded applications. LimChip stocks this exact part; confirm date code and tray condition by RFQ.
Stock & Date Code
| Brand | Part Number | Qty | D/C | Note |
|---|---|---|---|---|
| SK hynix | H9JCNNNBK3MLYR-N6E | 1,260 | 25+ | SK hynix H9JCNNNBK3MLYR-N6E 16Gb LPDDR5-6400 SDRAM, 512M×32, 1.05V, TFBGA-315; confirm date code, lot and packing condition by RFQ. |
Listed stock and date code are subject to final RFQ confirmation.
Memory Specifications
| Parameter | Value / Specification |
|---|---|
| Memory Type | LPDDR5 SDRAM |
| Density / Capacity | 16 Gb |
| Organization / Data Width | 512 32 ( × 32, 2 channel 16) |
| Speed / Data Rate | 6400 Mbps (LPDDR5-6400) |
| Supply Voltage (VDD1/VDD2/VDDQ) | 1.05 V (core) / 1.05 V (I/O) / 0.5 V (VDDQ) |
| CAS Latency | Programmable (LPDDR5 dynamic frequency scaling) |
| Number of Banks | 16 banks per channel (32 total) |
| Refresh | All-bank and per-bank refresh with temperature-compensated self-refresh |
| Operating Temperature | -25 °C to +85 °C (commercial) |
| Package / Case | TFBGA-315 (10 × 14.5 mm, 0.5 mm pitch) |
Memory Features & Applications
- 16 Gb LPDDR5-6400 SDRAM organized 512M×32 (dual 16-bit channels) for high-bandwidth, low-power mobile memory
- 6400 Mbps data rate — approximately 50% higher bandwidth than LPDDR4X at similar power envelope
- Ultra-low 1.05 V core supply with dynamic voltage and frequency scaling (DVFS) for optimal power/performance
- Dual 16-bit independent channels with 16 banks each for concurrent read/write and reduced latency
- Link ECC and write-X features improve data integrity and reduce command bus traffic for power savings
- 315-ball TFBGA (10 × 14.5 mm, 0.5 mm pitch) — compact PoP-compatible package for mobile and embedded SoC designs
Need Price & Availability for H9JCNNNBK3MLYR-N6E?
LimChip can confirm current price, date code, packing condition, lot traceability and shipment schedule for H9JCNNNBK3MLYR-N6E.
Listed stock is subject to final RFQ confirmation.
For faster RFQ confirmation, please include:
- Required quantity
- Target date code
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Commercial and shipment details for H9JCNNNBK3MLYR-N6E are confirmed with the formal quotation.
Shipping
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Frequently Asked Questions
Is H9JCNNNBK3MLYR-N6E available from LimChip?
LimChip can confirm current availability, price, quantity, date code and lead time for H9JCNNNBK3MLYR-N6E by RFQ.
What should buyers check before ordering H9JCNNNBK3MLYR-N6E?
Buyers should check memory density, speed suffix, package, temperature grade and batch traceability for H9JCNNNBK3MLYR-N6E, together with live stock and traceable supply.
How do I request a quote for H9JCNNNBK3MLYR-N6E?
Use the RFQ button and include required quantity, target date code, package/case requirement, delivery country, company name and contact details.