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H9HCNNNBKMMLHR-NME

Brand: SK hynix

H9HCNNNBKMMLHR-NME is an SK hynix 2 GB (16 Gb) LPDDR4X SDRAM organized x16 (2-channel) in a 200-ball FBGA package. LimChip stocks this exact ordering code; confirm date code and tray condition by RFQ. RFQ differentiator LHRNME, package code 200-ball FBGA keeps this catalogue entry distinct for package, suffix and lot-code review.

Stock & Date Code

Brand Part Number Qty D/C Note
SK hynix H9HCNNNBKMMLHR-NME 10,000 26+ H9HCNNNBKMMLHR-NME (2 GB (16 Gb) LPDDR4X SDRAM, x16 (2-channel), 1.8 V (VDD1) / 1.1 V (VDD2) / 0.6 V (VDDQ), 200-ball FBGA); confirm date code, lot and packing condition by RFQ.

Listed stock and date code are subject to final RFQ confirmation.

Memory Specifications

ParameterValue / Specification
Memory TypeLPDDR4 xDRAM
Density / Capacity2 GB (16 Gb)
Organization / Data Width× 16 (2-channel)
Speed / Data Rate4266 Mbps (LPDDR4 × -4266)
Package / Case200-ball FBGA
Supply Voltage (VDD / VDDQ)1.8 V (VDD1) / 1.1 V (VDD2) / 0.6 V (VDDQ)
Number of Banks16 (4 bank group 4 banks)
Burst Length8 (with burst chop 4)
Prefetch8n prefetch
Temperature Range (Tcase)Commercial (0 to 95 °C)
Refresh Cycle8192 refresh cycles / 64 ms (avg 7.8 µs @ 0–85 °C; 3.9 µs @ 85–95 °C)
ComplianceJEDEC LPDDR4 xDRAM; RoHS compliant

Memory Features & Applications

  • This 2 GB (16 Gb) LPDDR4X SDRAM delivers a 4266 Mbps data rate for bandwidth-intensive main-memory applications.
  • Organized as x16 (2-channel), the interface suits memory buses in compute and networking equipment.
  • It operates from a 1.8 V (VDD1) / 1.1 V (VDD2) / 0.6 V (VDDQ) supply, consistent with JEDEC LPDDR4X SDRAM specifications.
  • Housed in a 200-ball FBGA package, it provides a compact, high-density footprint for space-constrained boards.
  • Rated for the Commercial (0 to 95 °C) temperature range, it fits commercial-grade environments.
  • JEDEC features include 16 (4 bank group 4 banks), 8n prefetch, on-die termination (ODT), ZQ calibration and per-DRAM addressability for robust signal integrity.
  • Optional functions such as write leveling, data-bus inversion (DBI), CRC on writes and TCAR self-refresh improve reliability at speed.
  • RFQ differentiator LHRNME, package code 200-ball FBGA is checked during RFQ so buyers do not substitute nearby family variants.

Need Price & Availability for H9HCNNNBKMMLHR-NME?

LimChip can confirm current price, date code, packing condition, lot traceability and shipment schedule for H9HCNNNBKMMLHR-NME.

Listed stock is subject to final RFQ confirmation.

For faster RFQ confirmation, please include:
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Quality, Shipping & Payment

Commercial and shipment details for H9HCNNNBKMMLHR-NME are confirmed with the formal quotation.

Quality Confirmation

Date code, batch, package, label and marking details are checked before shipment. Inspection photos and third-party inspection support are available when required.

Shipping

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Frequently Asked Questions

Is H9HCNNNBKMMLHR-NME available from LimChip?

LimChip can confirm current availability, price, quantity, date code and lead time for H9HCNNNBKMMLHR-NME by RFQ.

What should buyers check before ordering H9HCNNNBKMMLHR-NME?

Buyers should check memory density, speed suffix, package, temperature grade and batch traceability for H9HCNNNBKMMLHR-NME, together with live stock and traceable supply.

How do I request a quote for H9HCNNNBKMMLHR-NME?

Use the RFQ button and include required quantity, target date code, package/case requirement, delivery country, company name and contact details.

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