K4UBE3D4AB-MGCL supports DDR, LPDDR and industrial memory platforms; LimChip focuses this listing on exact suffix, availability and shipment confirmation. This is a production-oriented spot stock item where package/case, batch condition and lead time should be confirmed by RFQ.
| Parameter | Value / Specification |
|---|---|
| Exact Part Number | K4UBE3D4AB-MGCL |
| Manufacturer | Samsung |
| Product Category | DRAM |
| Sourcing Focus | DDR, LPDDR and industrial memory platforms |
| BOM / RFQ Checks | density, speed suffix, temperature grade and batch consistency |
| Package / Case | FBGA / manufacturer suffix |
Buyers normally source K4UBE3D4AB-MGCL when an existing BOM requires the same manufacturer suffix for DDR, LPDDR and industrial memory platforms. The practical RFQ check is whether density, speed suffix, temperature grade and batch consistency, date code and package/case align with the buyer's board or repair demand. Useful for low-power memory designs where suffix matching is important.
LimChip can confirm current price, quantity, date code, batch condition and shipping schedule by RFQ.
10,000 listed as spot stock for LPDDR Memory demand; confirm current allocation and lead time by RFQ.
LimChip can confirm current availability, price, quantity, date code and lead time for K4UBE3D4AB-MGCL by RFQ.
Buyers should check memory density, speed suffix, package, temperature grade and batch traceability for K4UBE3D4AB-MGCL, together with live stock and traceable supply.
Use the RFQ button and include required quantity, target date code, company name and contact details.
LimChip can confirm current price, quantity, date code, batch condition and shipping schedule by RFQ.
| Brand | Part Number | Qty (PCS) | D/C | Note |
|---|---|---|---|---|
| Samsung | K4UBE3D4AB-MGCL | 10,000 | 26+ | Samsung LPDDR stock for compact embedded platforms |