Quality Confirmation
Date code, batch, package, label and marking details are checked before shipment. Inspection photos and third-party inspection support are available when required.
LIMCHIP CO., LIMITED
Professional Electronic Components Distributor · HK · SZ · SG · Original Stock · Global Shipping
H5TC4G63EFR-PBA
Brand: SK hynix
H5TC4G63EFR-PBA is an SK hynix 4 Gb DDR3 SDRAM organized 256 16 (x16) in a 96-ball FBGA package. LimChip stocks this exact ordering code; confirm date code and tray condition by RFQ.
Stock & Date Code
| Brand | Part Number | Qty | D/C | Note |
|---|---|---|---|---|
| SK hynix | H5TC4G63EFR-PBA | 8,000 | 26+ | H5TC4G63EFR-PBA (4 Gb DDR3 SDRAM, 256 16 (x16), 1.35 V, 96-ball FBGA); confirm date code, lot and packing condition by RFQ. |
Listed stock and date code are subject to final RFQ confirmation.
Memory Specifications
| Parameter | Value / Specification |
|---|---|
| Memory Type | DDR3 SDRAM |
| Density / Capacity | 4 Gb |
| Organization / Data Width | 256 16 ( × 16) |
| Speed / Data Rate | 1600 Mbps (DDR3-1600) |
| Package / Case | 96-ball FBGA |
| Supply Voltage (VDD / VDDQ) | 1.35 V |
| Number of Banks | 8 banks |
| Burst Length | 4 / 8 (with on-the-fly switch) |
| Prefetch | 8-bit prefetch |
| Temperature Range (Tcase) | Commercial (0 to 95 °C) |
| Refresh Cycle | 8192 refresh cycles / 64 ms (avg 7.8 µs @ 0–85 °C; 3.9 µs @ 85–95 °C) |
| Compliance | JEDEC DDR3 SDRAM; RoHS compliant |
Memory Features & Applications
- This 4 Gb DDR3 SDRAM delivers a 1600 Mbps data rate for bandwidth-intensive main-memory applications.
- Organized as 256 16 (x16), the interface suits memory buses in compute and networking equipment.
- It operates from a 1.35 V supply, consistent with JEDEC DDR3 SDRAM specifications.
- Housed in a 96-ball FBGA package, it provides a compact, high-density footprint for space-constrained boards.
- Rated for the Commercial (0 to 95 °C) temperature range, it fits commercial-grade environments.
- JEDEC features include 8 banks, 8-bit prefetch, on-die termination (ODT), ZQ calibration and per-DRAM addressability for robust signal integrity.
- Optional functions such as write leveling, data-bus inversion (DBI), CRC on writes and TCAR self-refresh improve reliability at speed.
Need Price & Availability for H5TC4G63EFR-PBA?
LimChip can confirm current price, date code, packing condition, lot traceability and shipment schedule for H5TC4G63EFR-PBA.
Listed stock is subject to final RFQ confirmation.
For faster RFQ confirmation, please include:
- Required quantity
- Target date code
- Package / case requirement
- Delivery country
- Company name and contact person
- Target price if available
Prefer email? Send this RFQ via email instead.
Quality, Shipping & Payment
Commercial and shipment details for H5TC4G63EFR-PBA are confirmed with the formal quotation.
Shipping
LimChip supports worldwide delivery through established logistics providers. Carrier, lead time, tracking and buyer-appointed freight-forwarder requirements are confirmed by our sales team.
Payment
Payment method, currency and trade terms are confirmed in the formal quotation or proforma invoice. Contact our sales team for the options available for your order.
Frequently Asked Questions
Is H5TC4G63EFR-PBA available from LimChip?
LimChip can confirm current availability, price, quantity, date code and lead time for H5TC4G63EFR-PBA by RFQ.
What should buyers check before ordering H5TC4G63EFR-PBA?
Buyers should check memory density, speed suffix, package, temperature grade and batch traceability for H5TC4G63EFR-PBA, together with live stock and traceable supply.
How do I request a quote for H5TC4G63EFR-PBA?
Use the RFQ button and include required quantity, target date code, package/case requirement, delivery country, company name and contact details.