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SDINBDG4-16G

Brand: SanDisk

The SDINBDG4-16G is a SanDisk iNAND 7250 eMMC 5.1 embedded flash drive with 16 GB capacity in a 153-ball BGA package (11.5 × 13 mm). Supporting HS400 interface mode for up to 330 MB/s sequential read, it delivers fast system boot and responsive application loading for entry-level smartphones, tablets, and IoT devices. The integrated NAND management (ECC, wear leveling, bad block management) simplifies host software integration and reduces development time for cost-sensitive consumer electronics.

Stock & Date Code

Brand Part Number Qty D/C Note
SanDisk SDINBDG4-16G 10,000 26+ SanDisk SDINBDG4-16G iNAND eMMC; confirm date code, lot and packing condition by RFQ.

Listed stock and date code are subject to final RFQ confirmation.

Storage Specifications

ParameterValue / Specification
Exact Part NumberSDINBDG4-16G
ManufacturerSanDisk (Western Digital)
Product CategoryeMMC Flash
Memory TypeeMMC 5.1 NAND Flash, iNAND 7250 series embedded managed NAND storage with integrated controller
Density / Capacity16 GB, single-package managed NAND with internal TLC/MLC flash array and eMMC 5.1 controller
Organization / Data Width8-bit HS400 eMMC 5.1 interface, JEDEC eMMC standard command set with boot and RPMB partitions
Speed / Data RateHS400 mode: up to 330 MB/s sequential read, 150 MB/s sequential write, 200 MHz DDR clock
Supply Voltage3.3 V (VCCQ), 1.8 V (VCC) dual-rail power, JEDEC eMMC 5.1 voltage specification
Operating Temperature-25 °C to +85 °C
Package / Case153-BGA (11.5 × 13 mm, 0.5 mm pitch, SMT, Tray)

Storage Features & Applications

  • 16 GB managed NAND with integrated eMMC 5.1 controller (iNAND 7250), delivering up to 330 MB/s sequential read via HS400 8-bit interface
  • Integrated flash management: ECC, wear leveling, bad block management, and garbage collection eliminate host NAND software complexity for faster time-to-market
  • JEDEC eMMC 5.1 compliant with boot partition, RPMB, and enhanced user data area for secure boot and trusted execution in Android and Linux embedded platforms
  • 153-ball BGA package (11.5 × 13 mm, 0.5 mm pitch), -25 °C to +85 °C operating range, Pb-free and RoHS compliant
  • Dual-rail 3.3 V / 1.8 V supply with low-power standby and sleep modes for battery-constrained mobile and IoT devices
  • Ideal for entry-level smartphones, Android tablets, smart TV main storage, IoT gateways, and industrial HMI requiring reliable, managed eMMC storage

Need Price & Availability for SDINBDG4-16G?

LimChip can confirm current price, date code, packing condition, lot traceability and shipment schedule for SDINBDG4-16G.

Listed stock is subject to final RFQ confirmation.

For faster RFQ confirmation, please include:
  • Required quantity
  • Target date code
  • Package / case requirement
  • Delivery country
  • Company name and contact person
  • Target price if available

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Quality, Shipping & Payment

Commercial and shipment details for SDINBDG4-16G are confirmed with the formal quotation.

Quality Confirmation

Date code, batch, package, label and marking details are checked before shipment. Inspection photos and third-party inspection support are available when required.

Shipping

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Payment

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Frequently Asked Questions

Is SDINBDG4-16G available from LimChip?

LimChip can confirm current availability, price, quantity, date code and lead time for SDINBDG4-16G by RFQ.

What should buyers check before ordering SDINBDG4-16G?

Buyers should check density, interface, package, firmware qualification and lifecycle status for SDINBDG4-16G, together with live stock and traceable supply.

How do I request a quote for SDINBDG4-16G?

Use the RFQ button and include required quantity, target date code, package/case requirement, delivery country, company name and contact details.

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