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KLM8G1GEUF-B04P

KLM8G1GEUF-B04P is the eight-gigabyte Samsung eMMC 5.1 automotive-p-code identity in a 153-ball FBGA, supporting HS200/HS400 and 1-bit, 4-bit or 8-bit buses. Its documented temperature range is -40°C to +95°C case; 330 mb/s sequential read and 40 mb/s sequential write under samsung internal hs400 ×8 test conditions. This is the documented base ordering identity without an unexplained numeric suffix.

Stock & Date Code

Brand Part Number Qty D/C Note
Samsung KLM8G1GEUF-B04P 11,200 26+ Samsung Electronics KLM8G1GEUF-B04P 8 GB eMMC 5.1 managed NAND flash with HS400; confirm date code, lot and packing condition by RFQ.

Listed stock and date code are subject to final RFQ confirmation.

Storage Specifications

ParameterValue / Specification
Memory TypeManaged NAND flash, eMMC 5.1
Density / Capacity8 GB
Organization / Data Width1-bit, 4-bit or 8-bit eMMC bus
Speed / Data RateHS200 and HS400; HS400 theoretical mmum 400 MB/s at 200 MHz, 1.8 V I/O and 8-bit bus
NAND Configuration64 Gb MLC ×1
Performance330 MB/s sequential read and 40 MB/s sequential write under Samsung internal HS400 ×8 test conditions
Supply VoltageVCC nominal 3.3 V; VCCQ supports 1.8 V / 3.3 V family operation
Operating Temperature-40°C to +95°C case
Package / Case153-ball FBGA, 11.5×13×0.8 mm
Partitions / SecurityBoot partitions, RPMB, general-purpose partitions and enhanced user data area supported at family level
LifecycleLifecycle sources conflict
Ordering-Code NoteThis is the documented base ordering identity without an unlained numeric suff .

Storage Features & Applications

  • KLM8G1GEUF-B04P provides a eight-gigabyte managed-NAND storage configuration using the automotive-p-code identity
  • eMMC 5.1 interface supports HS200 and HS400 transfer modes on 1-bit, 4-bit or 8-bit buses
  • 330 MB/s sequential read and 40 MB/s sequential write under Samsung internal HS400 ×8 test conditions distinguishes the documented performance coverage for this identity
  • Boot partitions and RPMB provide authenticated boot-data and replay-protected storage regions
  • Enhanced user data area and general-purpose partition support allow workload-specific allocation
  • 153-ball FBGA, 11.5×13×0.8 mm integrates NAND and controller in a board-level embedded package
  • Automotive temperature positioning extends operation to -40°C to +95°C case temperature

Need Price & Availability for KLM8G1GEUF-B04P?

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Listed stock is subject to final RFQ confirmation.

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Quality Confirmation

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Shipping

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Frequently Asked Questions

Is KLM8G1GEUF-B04P available from LimChip?

LimChip can confirm current availability, price, quantity, date code and lead time for KLM8G1GEUF-B04P by RFQ.

What should buyers check before ordering KLM8G1GEUF-B04P?

Buyers should check density, interface, package, firmware qualification and lifecycle status for KLM8G1GEUF-B04P, together with live stock and traceable supply.

How do I request a quote for KLM8G1GEUF-B04P?

Use the RFQ button and include required quantity, target date code, package/case requirement, delivery country, company name and contact details.

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