Server platform compute
EPYC server processors
EPYC supplies the host CPU in cloud, database, virtualisation and accelerated servers. In an AI server it runs host software and manages the memory and I/O paths feeding the accelerators; in a general server it also executes the application workload. Processor generation, memory capacity and expansion resources belong to the same platform decision.
Accelerated server workloads
Instinct AI and HPC accelerators
Instinct GPUs take on parallel AI training, inference and HPC work beside the host CPU. GPU memory holds model weights and working data; interconnects let accelerators exchange that data during distributed jobs. A usable deployment pairs the accelerator with supported ROCm software and frameworks, as well as the server’s power and cooling design.
Professional CPU workloads
Ryzen Threadripper workstations
Ryzen Threadripper and Threadripper PRO target workstation rendering, engineering and content production. These workloads use CPU parallelism, memory and expansion resources together. The processors belong to workstation platforms with their own board, memory and power requirements.
Display and professional graphics
Radeon graphics
Radeon RX serves client graphics, while Radeon professional products address workstation graphics and application workflows. A complete card includes its GPU, memory, power connections and display outputs. Professional-software validation applies to the documented card and driver combination.
Client and business systems
Ryzen and Ryzen AI processors
Ryzen processors cover desktop and notebook computing. Ryzen AI adds dedicated AI capability in supported products, while desktop, mobile and business configurations differ in graphics, acceleration and management features. These are platform choices as well as CPU choices.
Dedicated equipment platforms
Ryzen Embedded and EPYC Embedded
Ryzen Embedded and EPYC Embedded bring x86 processing to industrial computers, storage and networking equipment. They offer different mixes of compute, graphics and connectivity for dedicated boards. Package, operating temperature and lifecycle support are defined for each product.
