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225H

Brand: Intel

Intel Core Ultra 5 225H is a Series 2 Arrow Lake mobile processor featuring 14 cores (4 P-cores, 8 E-cores, 2 LP E-cores) and 14 threads — Hyper-Threading is NOT supported (cores = threads). It has 18 MB Intel Smart Cache, runs at up to 4.9 GHz max turbo (P-core), supports LPDDR5 × 8400 MT/s and DDR5 6400 MT/s memory with up to 128 GB capacity, integrates Intel Arc 130T GPU (7 Xe-vectors, up to 2.20 GHz), and uses the FCBGA2049 package (50 × 25 mm). Fabricated on TSMC N3B, the NPU delivers 13 TOPS for local AI.

Stock & Date Code

Brand Part Number Qty D/C Note
Intel 225H 720 25+ Intel 225H; confirm date code by RFQ.

Listed stock and date code are subject to final RFQ confirmation.

MCU / Processor Specifications

ParameterValue / Specification
Core / Architecture14 cores (4 P-cores + 8 E-cores + 2 LP E-cores), 14 threads; Arrow Lake (TSMC N3B); Hyper-Threading NOT supported
Clock FrequencyP-core: 1.7 GHz base, 4.9 GHz murbo; E-core: 1.3 GHz base, 4.3 GHz turbo; LP E-core: 700 MHz base, 2.5 GHz turbo
Cache18 MB Intel Smart Cache; Arrow Lake L2 per-core differs from Meteor Lake
Thermal Design Power28 W base; 115 W mmum turbo; NO Hyper-Threading (cores = threads)
MemoryLPDDR5 × 8400 MT/s; DDR5 6400 MT/s; up to 128 GB; 2 channels; ~134.4 GB/s
Integrated GraphicsIntel Arc 130T GPU, 7 x-vectors, up to 2.20 GHz; DP 2.1, HDMI 2.1
NPU (AI Accelerator)Intel AI Boost NPU, 13 TOPS (Int8); WebNN framework support added
InterfacesPCIe 5.0 and 4.0, up to 28 CPU lanes; Thunderbolt 4
Package / CaseFCBGA2049, 50 × 25 mm, 2049-ball BGA, tray (OEM)
LifecycleProduction; launched Q1'25; Arrow Lake is Series 2, TSMC N3B (not Intel 4)

Embedded Processor Features & Applications

  • 225H is Series 2 Arrow Lake: 14 cores but only 14 threads because Hyper-Threading is removed. Confirm OS threading model before BOM selection.
  • Fabricated on TSMC N3B (not Intel 4); Arrow Lake uses a chiplet/tile architecture different from Meteor Lake monolithic.
  • Intel Arc 130T GPU is a new graphics tile vs Meteor Lake Arc; 13 TOPS NPU is also updated vs Series 1.
  • Memory support upgraded to LPDDR5 × 8400 MT/s and DDR5 6400 MT/s with 128 GB max (vs 96 GB in Series 1).
  • Same FCBGA2049 footprint as Meteor Lake enables board reuse, but BIOS and VRM must be updated for Arrow Lake power behavior.
  • 28 W base / 115 W max TDP matches Series 1 H-series; minimum assured 20 W supports fanless configurations.

Need Price & Availability for 225H?

LimChip can supply 225H in tray condition. RFQ for current stock and lead time.

Listed stock is subject to final RFQ confirmation.

For faster RFQ confirmation, please include:
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Quality, Shipping & Payment

Commercial and shipment details for 225H are confirmed with the formal quotation.

Quality Confirmation

Date code, batch, package, label and marking details are checked before shipment. Inspection photos and third-party inspection support are available when required.

Shipping

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Frequently Asked Questions

Is 225H available from LimChip?

LimChip can confirm current availability, price, quantity, date code and lead time for 225H by RFQ.

What should buyers check before ordering 225H?

Buyers should check exact suffix, package, memory option, firmware compatibility and lifecycle status for 225H, together with live stock and traceable supply.

How do I request a quote for 225H?

Use the RFQ button and include required quantity, target date code, package/case requirement, delivery country, company name and contact details.

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