AMD documents two related but different ordering-code layouts for these cost-optimized 7 Series families. XC7A200T-2FBG676C is the complete Artix-7 device fitted to the AC701 evaluation board. XC7S50-2FGGA484C is AMD's complete Spartan-7 example in DS180. In both cases the purchasing rule is the same: preserve every character from the device type through the final temperature letter.
The difference is in the package block. Artix-7 separates package type, Pb-free field and pin identifier as FB | G | 676. Spartan-7 separates package type, Pb-free field and a footprint identifier as FG | G | A484. Treating those middle characters as a generic “BGA suffix” removes information needed for land pattern, materials, pinout and qualification review.
Open the full-size Artix-7 and Spartan-7 ordering diagram and zoom.
Decode the two complete OPNs #
| Family | Complete example | Field sequence | What the package block says |
|---|---|---|---|
| Artix-7 | XC7A200T-2FBG676C | XC7A200T · -2 · FB · G · 676 · C | FB package type, G material field, 676 pin-count identifier |
| Spartan-7 | XC7S50-2FGGA484C | XC7S50 · -2 · FG · G · A484 · C | FG package type, G Pb-free field, A484 footprint identifier and pin count |
For Artix-7, XC7A200T identifies a commercial 7 Series Artix device and member. The AC701 guide names the exact XC7A200T-2FBG676C device, so the example is an official fitted OPN rather than a distributor-created combination. -2 is its speed grade. FBG676 is the complete package identity, and C is the commercial temperature range.
For Spartan-7, XC7S50 identifies the commercial Spartan-7 S50 member. DS180 Figure 1 then assigns -2 to speed, FG to package type, G to Pb-free status, A484 to the package designator and pin count, and C to the commercial range. The embedded A is part of the official footprint identifier; it must not be dropped when an RFQ is normalized.
Package characters do not mean the same thing everywhere #
DS180 uses the G field differently according to package family. For Artix-7 CPG, CSG, FTG and FGG packages, G denotes RoHS 6/6. For FFG, FBG, SBG, FLG and FHG packages, G denotes RoHS 6/6 with Exemption 15. That makes FBG676 a material-specific package name, not merely “FBGA, 676 balls.”
Spartan-7's official format adds a distinct footprint identifier after the Pb-free field. In FGGA484, FG is the package type, the next G is the Pb-free field, and A484 is the footprint identifier. AMD lists FGGA484 as a 23 × 23 mm, 1.0 mm-pitch package and FBG676 as a 27 × 27 mm, 1.0 mm-pitch Artix package. Matching ball-count digits alone cannot bridge those different bodies or pin maps.
DS180 also cautions that a package name does not always equal the physical pin count. Procurement records should therefore retain the official package code and link it to the exact UG475 pinout file rather than silently converting it to a generic ball-count description.
Speed, voltage and temperature are one offered combination #
The Spartan-7 ordering figure documents -L1, -1 and -2 speed forms. DS180 lists commercial C, industrial I and expanded Q temperature ranges for Spartan-7, with Q extending from -40°C to +125°C. Not every device-package-grade combination is available, so a wider range is only a candidate until the current device table and implementation target confirm it.
The shared Artix-7 ordering figure documents -L1, -L2, -G2, -1, -2 and -3 syntax, but those forms are not universally offered. DS181 version 1.27.1 lists Artix-7 production speed specifications and explains that -1LI runs at 0.95 V, while -2L can use 1.0 V or 0.9 V with different power and performance behavior. The final C, E or I temperature letter must be evaluated with the device, package, speed and core-voltage selection.
A faster or wider-temperature OPN is not an automatic purchasing upgrade. Confirm the exact selectable part in Vivado, rerun timing and power analysis, and verify the board's rail and thermal assumptions before approval.
Artix-7 and Spartan-7 are not cross-family pin substitutes #
UG475 states the boundary directly: 7 Series devices are pin compatible only with other 7 Series devices of the same family in the same package. The same document notes additional compatible package groups within a family and specifically identifies Artix-7 FGG and FBG packages of the same pin count as pin compatible. Even then, decoupling recommendations can differ.
This rules out using an apparently similar Artix-7 and Spartan-7 suffix as proof of a drop-in replacement. The families have different device resources and package offerings. AMD's current product tables show Spartan-7 without serial transceivers, while Artix-7 members include GTP transceivers and PCIe-capable options. A board designed around those blocks cannot be migrated by editing the family letter in a BOM.
Within one family and one supported package, UG475 still requires device-level review. Package balls can move between banks, a clock-capable or differential pin on one member can become a different pin type on another, bank voltage groupings can change, and XADC auxiliary inputs are not always routed to the same balls. The package pinout files explicitly mark no-connect differences used for migration planning.
| Proposed change | Procurement and engineering status |
|---|---|
| Same device and package, supported faster speed | Candidate only after timing, voltage, power and thermal review |
| Same device and package, C to I temperature | Qualification candidate when the exact OPN is offered |
| Different Artix-7 member in the same package | Same-family migration; compare every assigned ball, bank and hard block |
| FGG to FBG with the same Artix-7 pin-count designator | Official footprint-compatibility starting point; review decoupling and exact device support |
| Artix-7 to Spartan-7, even with similar digits | Cross-family redesign; no pin-compatibility claim |
| FBG676 to FGGA676 or FGGA484 | Different package identity and family table; PCB and pinout review required |
Procurement checklist #
- Put the full XC7A200T-2FBG676C or XC7S50-2FGGA484C string on the RFQ, purchase order and incoming-inspection record.
- Separate the fields using the family-specific AMD diagram; do not apply the Artix package split to Spartan-7 or vice versa.
- Match the complete package identity, not only 484 or 676.
- Confirm the device-package row in DS180 or the current AMD selection guide.
- Use UG475 and the exact package pinout file for every device migration.
- Recheck bank voltages, clock-capable pins, differential pairs, configuration pins, XADC pins and transceiver connections.
- Select the proposed OPN in Vivado and rerun implementation, timing and power checks.
- Specify tray or reel, moisture condition, date code, lot traceability, quantity and delivery separately; those logistics are not encoded by these OPN diagrams.
Conclusion #
Artix-7 and Spartan-7 share a 7 Series heritage, but their official package-field layouts are not interchangeable. Preserve FBG676 as one Artix package identity and FGGA484 as one Spartan package identity, then keep speed and temperature attached to the complete device string. Same-family, same-package evidence can begin a migration review; it cannot replace pinout, implementation, power and qualification checks, and it never establishes an Artix-to-Spartan drop-in substitute.
Official references #
- AMD 7 Series FPGAs Data Sheet: Overview DS180
- AMD 7 Series FPGAs Packaging and Pinout Product Specification UG475
- AMD Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics DS181
- AMD AC701 Evaluation Board for the Artix-7 FPGA User Guide UG952
- AMD Artix-7 FPGA product page and current device table
- AMD Spartan-7 FPGA product page and current device table
- AMD Cost-Optimized Portfolio Product Selection Guide XMP100
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