AMD Kintex UltraScale+ Ordering Codes Guide

XC2KU050P-1NSVN1369E is the current DS890 Figure 4 example for an UltraScale+ FPGA ordering code. Read left to right, it identifies a commercial Kintex UltraScale+ Gen 2 device, value index 050, UltraScale+ generation, -1 speed grade, N package technology, lidless-stiffener construction, RoHS 6/6 material set, N1369 footprint and extended-temperature grade.

Every field matters to purchasing. KU050P alone does not identify the package, voltage/speed point or temperature qualification, and N1369 alone does not prove compatibility with another device using 1,369 balls.

Open the full-size Kintex UltraScale+ ordering diagram and zoom.

Decode XC2KU050P-1NSVN1369E #

The leading 2 deserves special attention. Current DS890 says that this generation character is present only in Kintex UltraScale+ Gen 2 ordering codes. It must not be copied into Virtex, Artix, Spartan or first-generation Kintex OPNs.

KU value index and Gen 2 boundary #

KU is the Kintex family identifier, while 050 is the resource tier. A different index changes silicon resources and can change transceiver count, hard blocks, I/O availability, power and valid packages. P identifies the UltraScale+ generation; it is not a packing suffix.

The Gen 2 digit changes the syntax and device platform. A first-generation XCKU part and an XC2KU part that share a similar value index should not be treated as one sourcing pool. Confirm the exact device-package combination in current DS890 and UG575 before comparing availability.

Speed, voltage and temperature must be checked together #

DS922 documents -3, -2 and -1 speed grades, with -3E providing the highest performance. It also documents -2LE and -1LI low-power operating points at 0.85 V or 0.72 V. The ordering figure writes low-power codes as -L1 and -L2, while DS922 defines the electrical and timing behavior.

A faster grade is not automatically a purchasing-only replacement. Re-run timing at the implemented VCCINT point, check power estimates and thermal limits, and confirm that AMD offers the exact device, package and temperature combination. E and I identify operating-temperature qualification; they do not describe shipment or storage conditions.

NSVN1369 is a complete package constraint #

The four package fields have different meanings. N defines 0.92 mm-pitch flip-chip technology without LSC. S indicates lidless-stiffener construction. V is the RoHS 6/6 material code. N1369 identifies the package variant and 1,369-ball footprint.

Changing S to a lid code changes mechanical and thermal integration. Changing V to G changes the material declaration. Changing N1369 to another 1,369-ball designator can alter package geometry, bank mapping or supported device combinations even though the ball count remains the same. Compare the exact UG575 drawing, bank diagram and package files.

Shortage substitution screening #

If XC2KU050P-1NSVN1369E is unavailable, first hold XC2KU050P and NSVN1369 constant. An I-grade candidate can be screened only when AMD lists that exact combination and engineering confirms the applicable DS922 conditions. A broader temperature range may cost more and can have different lead time.

Do not call a different package, value index or generation pin-compatible from the name alone. A candidate with the same KU050P core but a different footprint requires PCB and implementation review. A first-generation XCKU device is a platform migration, not a suffix substitute.

Pin-to-pin and migration limits #

Before approving any alternate, compare the complete OPN, DS890 device-package table, UG575 pinout and package files, I/O-bank voltages, configuration pins, transceiver reference clocks and power pins. Then run the Vivado device-migration and implementation flow. Shared family branding or equal ball count is not pin-compatibility evidence.

XC and XQ are also separate qualification families. Defense-grade XQ ordering information belongs to DS895 and cannot be inferred by replacing the commercial prefix.

Procurement checklist #

• Quote the full OPN, quantity and date-code requirement.
• Confirm whether the generation digit is present.
• Verify value index and P suffix.
• Match speed grade and intended VCCINT operating point.
• Match all four package fields: N, S, V and N1369.
• Confirm temperature grade and exact orderable combination.
• Check lifecycle and production status.
• Require labeling, MSL, moisture-barrier and traceability evidence for non-authorized supply.

Conclusion #

The safe sourcing key is XC2KU050P-1NSVN1369E in full. The Gen 2 digit, speed/voltage point and NSVN1369 construction are independent constraints. Keep the silicon generation and complete package fixed before screening temperature or speed alternatives; treat any package, value-index or family change as an engineering migration.

Official references #

• AMD UltraScale Architecture and Product Data Sheet: Overview (DS890)
• AMD Kintex UltraScale+ FPGA Data Sheet: DC and AC Switching Characteristics (DS922)
• AMD UltraScale and UltraScale+ FPGAs Packaging and Pinouts (UG575)
• AMD Kintex UltraScale+ product brief