XCVU7P-1FLVA2104E is not just “a VU7P.” Its complete ordering code identifies a commercial Virtex UltraScale+ FPGA, value index 7, speed grade -1, 1.0 mm-pitch flip-chip SSI package with lid, RoHS 6/6 material set, A2104 footprint and extended-temperature qualification. A quotation that omits any of those fields is incomplete.
The fastest safe way to source a shortage alternate is therefore to compare the full OPN from left to right. Density, package footprint and construction are board-level constraints. Speed, voltage and temperature fields can sometimes be upgraded, but only when the exact combination is listed by AMD and the design is revalidated against the applicable data sheet.
Open the full-size Virtex UltraScale+ ordering diagram and zoom.
Decode XCVU7P-1FLVA2104E field by field #
| Field | Value | Procurement meaning |
|---|---|---|
| Commercial prefix | XC | Standard commercial device family, not an XQ defense-grade ordering code |
| Product family | VU | Virtex UltraScale+ FPGA |
| Value index | 7 | VU7P resource tier; it is not a package code |
| Architecture suffix | P | UltraScale+ device generation |
| Speed grade | -1 | The slowest standard speed grade in the Figure 4 syntax |
| Package technology | F | Flip-chip package with 1.0 mm ball pitch |
| Lid or construction | L | Lidded stacked-silicon-interconnect package construction |
| Material code | V | RoHS 6/6 material declaration |
| Footprint | A2104 | Package variant A with 2,104 balls |
| Temperature | E | Extended-temperature grade |
The hyphen is part of the speed-grade presentation, while the package letters must be read as separate positions. FLVA2104 does not mean one reusable “FLV package family” that can be exchanged freely: F, L, V and A2104 each carry a different purchasing constraint.
Value index and Virtex UltraScale+ family boundaries #
VU3P, VU5P, VU7P, VU9P and the larger Virtex UltraScale+ members are different silicon capacities. Moving from VU7P to VU9P is not a speed upgrade; it changes device resources and can change available transceivers, hard blocks, power demand and valid packages. The current AMD Virtex UltraScale+ product page also separates standard, 58G PAM4 and HBM-focused offerings. Similar names do not make those subfamilies interchangeable.
The P immediately after the value index is the UltraScale+ generation marker in this syntax. It must not be confused with a shipment suffix or package material code. The optional generation character shown in the current DS890 Figure 4 applies to Kintex UltraScale+ Gen 2 devices, not to this Virtex example, so it is deliberately absent from XCVU7P-1FLVA2104E.
Speed grade, voltage and temperature are a combined check #
AMD DS923 lists Virtex UltraScale+ speed grades -3, -2 and -1. It also documents -2L operation and the voltage-dependent performance boundary. The ordering diagram writes low-power grades as -L1 or -L2, while the electrical data sheet determines which devices, voltages and temperature ranges are actually supported.
Do not assume that a numerically faster grade is a transparent purchasing replacement. A candidate must satisfy the implemented timing constraints at its actual VCCINT operating point, power estimates, startup behavior and thermal limit. The -3E option is the highest-performance commercial combination described by DS923; not every device is offered in every speed and temperature combination.
E and I are qualification fields, not storage-temperature labels. An industrial-temperature candidate can cover a wider operating range than an extended-temperature part, but that alone does not prove that the complete OPN is orderable or qualified for the same system. Keep the family, value index, speed/voltage point, full package and material code fixed before treating E-to-I screening as a possible alternate.
FLVA2104 is the board-level compatibility anchor #
UG575 confirms the XCVU7P bank arrangement in the FLVA2104 package. In the worked OPN, F specifies 1.0 mm flip-chip technology, L specifies the lidded SSI construction, V specifies RoHS 6/6 material, and A2104 identifies the footprint and 2,104-ball count.
Changing A2104 to B2104 or C2104 may preserve the nominal ball count while changing the package variant and available transceiver or hard-block connectivity. Changing FLVA2104 to a 1,517-ball or 2,577-ball package clearly changes the PCB footprint. Neither case should be described as pin-to-pin without comparing AMD's device-package table, package drawing, bank map and package files.
The same rule applies to lid and material letters. A bare-die, lidless-stiffener or overhang construction has different mechanical and thermal integration requirements. V and G also carry different RoHS declarations. A distributor should quote the exact approved construction instead of silently normalizing these letters.
Shortage substitution example #
Suppose XCVU7P-1FLVA2104E is unavailable and an industrial-temperature candidate is offered. It is a possible screening path only if the candidate remains XC + VU7P + -1 + FLVA2104 and AMD lists that exact I-grade combination. Even then, engineering should reconfirm DS923 operating conditions, timing, power and the production qualification record before approving the AVL change. The broader temperature grade may cost more and may have different availability.
By contrast, XCVU7P-1FFVC1517E is not a drop-in substitute. The package technology, lid/material sequence and 1,517-ball footprint differ. A VU9P in FLVA2104 is also not automatically equivalent because the silicon member changes even if the package string looks familiar.
Pin-to-pin and migration boundary #
Pin compatibility is established by the exact device-package combination, not by a shared Virtex UltraScale+ label. For any proposed migration, compare:
1. Full package designator and ball count. 2. AMD device-package combination table. 3. UG575 bank and package diagrams plus the package files. 4. Dedicated configuration, power, transceiver and reference-clock pins. 5. I/O-bank voltage assignments and PCB power distribution. 6. Vivado device migration and implementation results.
UG575 shows that XCVU7P and XQVU7P package drawings can appear in the same packaging discussion, but XC and XQ are separate qualification families. Do not convert an XC sourcing problem into an XQ substitution claim without the defense-grade ordering and qualification documents.
RFQ and incoming-inspection checklist #
Send the complete OPN, required quantity, date-code policy and acceptable lot condition. Then verify the following before purchase-order release:
- Exact XCVU value index and P suffix.
- Speed grade and intended VCCINT operating point.
- Full package string, including construction and material letters.
- Footprint identifier and ball count.
- Temperature grade and required qualification.
- AMD lifecycle and production status for the exact combination.
- Tray, moisture-barrier, MSL and labeling evidence at incoming inspection.
- Marking photographs and traceability when buying outside an authorized channel.
Conclusion #
For Virtex UltraScale+, the safe sourcing key is the complete code, not VU7P alone. Keep the silicon member and FLVA2104 package fields fixed first; then evaluate speed/voltage and temperature alternatives using DS923 and the exact orderable combination. Any package, footprint, construction or family change belongs in an engineering migration review, not a purchasing-only substitution.
Official references #
- AMD UltraScale Architecture and Product Data Sheet: Overview (DS890)
- AMD Virtex UltraScale+ FPGA Data Sheet: DC and AC Switching Characteristics (DS923)
- AMD UltraScale and UltraScale+ FPGAs Packaging and Pinouts (UG575)
- AMD Virtex UltraScale+ FPGAs product page
- AMD Virtex UltraScale+ available PCIe blocks by device and package
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