AMD Artix UltraScale+ Ordering Codes Guide

XCAU15P-1SBVB484E identifies much more than an AU15P FPGA. Read from left to right, it specifies a commercial Artix UltraScale+ device, AU15P resource tier, -1 performance point, SBVB484 package construction and footprint, and extended-temperature grade. Buyers should quote and receive the complete orderable part number, because the package letters and temperature suffix are independent purchasing constraints.

The safest shortage-screening rule is simple: hold the silicon device and complete package string fixed first. A faster supported speed grade or wider supported temperature grade may be a candidate after timing, voltage and thermal review. A different device value, package footprint, ball count or package-construction code is an engineering migration, not a purchasing substitution.

Open the full-size Artix UltraScale+ ordering diagram and zoom.

Decode XCAU15P-1SBVB484E field by field #

SBVB484 must be treated as four meaningful positions rather than a decorative package suffix. The package-technology letter, construction letter, material letter and footprint identifier collectively define the mechanical orderable package. Similar-looking strings can still describe different ball maps or body formats.

Device value and family boundaries #

AU7P, AU10P, AU15P, AU20P and AU25P are distinct device members. The value index is not a speed bin and does not promise drop-in migration. Current AMD selection material shows that package availability differs by member; for example, SBVB484 is associated with selected AU10P and AU15P configurations, while other members use different package choices.

Changing AU15P to AU10P or AU20P changes device resources and can affect I/O availability, transceiver placement, clocks, hard blocks and bitstream targeting. Even if two members appear in one package table, pin compatibility must be proven with the current package and pinout data, followed by a fresh implementation and board review.

Speed, voltage and temperature grades #

DS931 lists production combinations by device. For XCAU7P and XCAU10P, current production entries include -2E, -2I, -1E, -1I and -1LI combinations, with the listed VCCINT operating point depending on the exact grade. This is why “-2 is faster than -1” is not enough for procurement approval: the complete speed, voltage and temperature combination must exist for the selected device.

When stock is tight, a supported faster grade can be screened as an alternate only after confirming Vivado speed-file support, timing closure, power, transceiver limits and required VCCINT. Likewise, replacing E with I is not automatically an upgrade unless the exact device-package-speed combination is orderable and the system qualification accepts the industrial range.

What SBVB484 tells the buyer #

AMD’s current Artix UltraScale+ selection guide identifies SBVB484 as a 19 × 19 mm, 0.8 mm-pitch, 484-ball package option for selected family members. Package dimensions and pitch matter to PCB land pattern, escape routing, assembly profile, inspection and rework.

Do not substitute UBVA368, FFVB676 or another package merely because the same AU device name appears. Different package codes indicate different footprints and ball counts and therefore cannot be assumed pin-to-pin. The package-specific I/O, transceiver and PCIe availability must also be checked; AMD’s PCIe product guide lists capabilities by exact device and package combination.

Shortage substitution screen #

An alternate should never be approved from distributor title text alone. Ask for the full manufacturer OPN, label photographs, package condition, lot/date information and traceability. Compare the received marking and packing documentation with the purchase order before release to production.

Pin-to-pin and migration boundary #

The complete device-package pair is the starting point for pin migration, not the family name. Use the current AMD package and pinout specification to compare every power, configuration, dedicated, transceiver and user-I/O ball. Then regenerate the implementation for the exact target and review the resulting pin assignments and bank standards.

Even when AMD documentation shows a migration path, board-level validation remains necessary. Check VCCINT and auxiliary rails, bank voltages, configuration mode, clocks, transceiver reference clocks, thermal solution and assembly limits. A compatible footprint does not make two bitstreams interchangeable.

Procurement checklist #

• Put the full XCAU15P-1SBVB484E string on the RFQ, purchase order and incoming-inspection record.
• Confirm the exact device member and UltraScale+ P suffix.
• Match all four package-related positions: S, B, V and B484.
• Verify that the requested speed and temperature combination appears in current DS931 production tables.
• Check 19 × 19 mm body, 0.8 mm pitch and 484-ball handling requirements for SBVB484.
• Require engineering approval for any device, package, qualification or voltage change.
• Confirm packing method, MSL condition, date code, traceability and shipment schedule before order release.

Conclusion #

For Artix UltraScale+ sourcing, the reliable key is the complete orderable part number. Keep XCAU15P and SBVB484 fixed before considering grade alternatives. Treat changes to device value, package string or qualification prefix as engineering migrations, and use current AMD device, package and speed documentation as the approval baseline.

Official references #

• AMD Artix UltraScale+ FPGA product page
• AMD Artix UltraScale+ product brief
• AMD Artix UltraScale+ FPGA data sheet DS931
• AMD DS931 speed-grade designations
• AMD UltraScale+ FPGA product selection guide
• AMD UltraScale architecture packaging and pinouts UG575
• AMD PCI Express integrated-block availability PG213