AMD Xilinx Kintex-7 Ordering Codes Guide

AMD Xilinx DS180 uses XC7K325T-2FBG900C as the 7 Series ordering example. Read it as XC7K325T | -2 | FB | G | 900 | C: device type, speed grade, package type, Pb-free field, pin-count identifier and temperature range.

The complete orderable part number matters. A request shortened to XC7K325T does not identify timing, package footprint, temperature range or material construction.

Open the full-size Kintex-7 ordering diagram and zoom.

Decode XC7K325T-2FBG900C field by field #

Device type and density are not interchangeable #

The XC7K325T device contains 326,080 logic cells, 840 DSP slices, 16,020 Kb of block RAM and 16 GTX transceivers according to DS180. Other Kintex-7 members range from XC7K70T through XC7K480T, but a larger number is not a transparent replacement. Logic, RAM, DSP, GTX count, I/O banks and available packages all change by member.

The initial XC also matters. This guide covers standard commercial Kintex-7 ordering syntax. XA and XQ products have automotive or defense-grade requirements, screening and supported combinations that must be checked in their own official data sheets.

Speed grade has performance, voltage and power implications #

For Kintex-7, -3 is the highest-performance standard grade, followed by -2 and -1. The ordering figure also documents -L1, -L2 and -G2 forms. L identifies lower-power speed grades; DS180 notes that -L2 can involve 1.0 V, 0.9 V or 0.95 V combinations depending on device and temperature. G2 identifies -2 devices with higher-performance transceivers.

Therefore, replacing -2 with -3 is not merely buying a faster label. The exact device, package and temperature combination must exist, and engineering must review timing, power, voltage rails and GTX requirements. Replacing -2 with -1 is a downgrade and requires a complete timing closure review.

FBG900 is one package identity #

FB, G and 900 are separate decoded fields, but together they form the package identity FBG900. DS180 lists FBG484, FBG676, FFG676, FBG900, FFG900, FFG901 and FFG1156 for Kintex-7, all at 1.0 mm ball pitch. The body sizes range from 23 × 23 mm to 35 × 35 mm.

AMD explicitly states that FBG900 and FFG900 are footprint compatible, as are FBG676 and FFG676. That official statement is a useful screening signal, not permission to exchange any two devices carrying those packages. The selected member must be supported in both packages, and GTX capability differs: DS180 limits GTX transceivers in FBG676 and FBG900 to 6.6 Gb/s, while the package and signal-integrity requirements still need project review.

Temperature substitution example #

DS180 lists both -2C and -2I for XC7K325T. Consequently, XC7K325T-2FBG900I can be an engineering alternate candidate when XC7K325T-2FBG900C is unavailable: device, speed and FBG900 package remain unchanged, while I extends the lower junction-temperature limit from 0°C to -40°C and the upper limit from +85°C to +100°C.

This is a one-way environmental upgrade candidate, not automatic pin-to-pin approval. Engineering should confirm the exact I-grade OPN is orderable, compare the package pinout file, rerun implementation for the target, review timing and power, and update the approved-vendor record. Industrial-grade stock can also cost more. A C-grade device cannot replace an I-grade requirement in the reverse direction.

Pin-to-pin and footprint boundaries #

The same FBG900 suffix is necessary for the closest mechanical replacement but does not prove electrical compatibility between different Kintex-7 densities. DS180's package table shows which devices are offered in each package and how many HR and HP I/Os and GTX channels are available. UG475 and the AMD package pinout files are the authority for actual ball assignments.

Before approving a substitute, compare every power, configuration, JTAG, GTX reference-clock, XADC and user-I/O ball. Recompile the design for the proposed target in Vivado and review pin planning, timing, transceiver and power reports. A package-body match without this work is only footprint similarity.

Procurement checklist #

1. Copy the complete OPN from the released BOM, including speed and temperature grades. 2. Match the XC7K device type and exact density before considering an alternate. 3. Keep FB, G and 900 together as the full FBG900 package identity. 4. Verify the device-package combination, body size, pitch and package pinout in DS180 and UG475. 5. Treat faster speed or wider temperature coverage as engineering candidates, not purchasing approval. 6. Check GTX rate, I/O-bank population, voltage rails and all assigned balls. 7. Recompile for the proposed device and review timing, power and programming output. 8. Confirm lifecycle, traceability, date code, moisture condition, packing medium, quantity, lead time and price.

Conclusion #

A Kintex-7 OPN is complete only when device type, speed, package, Pb-free field, pin identifier and temperature are present. Same-device FBG900 industrial stock can be a practical shortage candidate for a commercial part, but official package support, exact pinout and a project-specific Vivado review still determine whether it is safe to use.

Official references #

• AMD Xilinx 7 Series FPGAs Data Sheet: Overview DS180
• AMD Xilinx 7 Series Packaging and Pinout Specification UG475
• AMD Xilinx Kintex-7 DC and AC Switching Characteristics DS182
• AMD Kintex-7 FPGA product overview and product table
• AMD board and system design package-pinout resources