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W25N01GVZEIGTR

Winbond Electronics

产品属性

属性	数值
Density / Capacity	1 Gb (128 M × 8) SLC NAND through SPI / Quad I/O
Organization / Data Width	SPI single, dual and quad I/O (x1 / x2 / x4)
Interface	SPI / Dual SPI / Quad SPI
Speed / Data Rate	104 MHz SPI clock; continuous read up to 52 MB/s
Page / Block Geometry	2048 B data + 64 B spare per page; 64 pages per block
ECC	On-chip 1-bit ECC per 528 B; bad-block management
Supply Voltage	2.7 V to 3.6 V
Operating Temperature	-40 °C to +85 °C (industrial)
Lifecycle	Scheduled EOL reported by distributor
Package Details	8-WSON, 8×6 mm

发货前核对批次、封装、标签及丝印。可按需提供验货照片，并协助第三方检验。

支持全球交付。承运商、交期及买方指定货代要求，在报价时确认。

付款方式、币种及贸易条款，以正式报价或形式发票为准。