Altera's official MAX V Figure 1-1 sample 5M40ZE64C4N reads as 5M | 40Z | E | 64 | C | 4 | N. It identifies the MAX V family, a 40-logic-element device, 64-pin EQFP package, commercial temperature grade, speed grade 4 and lead-free packaging.
The complete orderable part number matters. A request shortened to 5M40Z does not specify the footprint, pin count, temperature range, speed grade or final material suffix.
Open the full-size MAX V ordering diagram and zoom.
Decode 5M40ZE64C4N field by field #
| Field | Example | Official meaning | Procurement check |
|---|---|---|---|
| Family signature | 5M | MAX V | Do not apply MAX 10 or MAX II suffix rules to this family. |
| Device type | 40Z | 40 logic elements | The documented device types run from 40Z through 2210Z. |
| Package type | E | Plastic Enhanced Quad Flat Pack | T, F and M identify TQFP, FineLine BGA and Micro FineLine BGA. |
| Pin count | 64 | 64 pins for the chosen package | Package letter and pin count must be treated as one footprint identity. |
| Temperature | C | Commercial, 0°C to 85°C junction | I covers −40°C to 100°C; A covers −40°C to 125°C. |
| Speed grade | 4 | Fastest of grades 4 and 5 | Timing must be checked for the exact target OPN. |
| Optional suffix | N | Lead-free packaging | Do not drop the final material or shipment suffix from an RFQ. |
Device types and density are not footprint promises #
MAX V device types are 40Z, 80Z, 160Z, 240Z, 570Z, 1270Z and 2210Z, corresponding to 40 through 2,210 logic elements. The current official product table also lists equivalent macrocells, user flash memory, I/O counts and package availability. Those resource differences can affect fit, power and pin use even where migration is supported.
Density alone never proves a replacement. For example, 5M570Z, 5M1270Z and 5M2210Z are offered in a 256-pin FineLine BGA migration group, but their available user-I/O counts differ. The largest planned density can require more power pins, so a board intended for later migration must be laid out against that largest device from the start.
Package letter and pin count must stay together #
The official decoder defines four package letters: T for TQFP, F for FineLine BGA, M for Micro FineLine BGA and E for EQFP. The following number is the pin or ball count for that package.
Consequently, E64, M64 and M68 are different physical packages even though their numbers are close. A change from F256 to F324 is also a PCB redesign, not a pin-compatible substitute. Buyers should confirm the full package code, package drawing, pitch, body dimensions and shipping condition before accepting stock.
Temperature and speed substitution example #
Official Altera material records exist for both 5M1270ZF256C5N and 5M1270ZF256I5N. Their family, density, package and speed grade match. The I device extends the low-temperature limit from 0°C down to −40°C while retaining the 100°C industrial upper limit documented by the ordering guide.
That makes 5M1270ZF256I5N a reasonable engineering alternate candidate when 5M1270ZF256C5N is unavailable. It is not an automatic purchasing substitution: engineering still needs to confirm the complete pin assignment, power-pin plan, timing model, programming file, environmental qualification and approved-vendor record. The industrial device may also cost more.
The reverse substitution is not equivalent. A commercial C5 device does not cover an industrial I5 requirement. Likewise, changing from grade 4 to grade 5 moves to the slower speed grade and requires timing review; grade 4 can be a performance upgrade candidate for grade 5 only after the exact orderable combination and implementation are validated.
Pin-to-pin and vertical-migration boundaries #
The MAX V handbook defines vertical migration within specific package groups, not across every device sharing the 5M prefix. Dedicated and JTAG pins must align, and power pins are subsets or supersets within a supported package path. Altera instructs designers to lay out for the largest planned density because it has the highest power-pin count.
I/O migration requires another check. The handbook tells designers to cross-reference device pin-outs for every planned density and notes that Quartus can use a device migration list to cross-reference and place pins. Therefore the same F256 package is necessary for an F256 migration candidate, but it is not sufficient evidence that an already routed design can accept any F256 density.
Procurement checklist #
1. Copy the complete OPN from the released BOM, including N or any other documented final suffix. 2. Match the 5M family and exact device type before considering an alternate. 3. Match package letter and pin count; verify package drawing, pitch and PCB land pattern. 4. Treat wider temperature coverage or a faster speed grade as an engineering candidate, not automatic approval. 5. Check the official vertical-migration group, all assigned I/Os, JTAG pins and power-pin supersets. 6. Recompile for the proposed target and review timing, power and programming output. 7. Confirm lifecycle, traceability, date code, quantity, packing medium, qualification and price before release.
Conclusion #
A MAX V OPN is only complete when the device type, package letter, pin count, temperature grade, speed grade and suffix are all present. A same-package industrial or faster device can be a useful shortage alternate, but pin-to-pin status still depends on the official migration path, power-pin planning and a project-specific Quartus check.
Official references #
- MAX V Device Handbook, including Figure 1-1 ordering information
- MAX V CPLD Product Table
- MAX V Featured Documentation Quick Links
- 5M1270ZF256C5N official material declaration
- 5M1270ZF256I5N official material declaration
- 5M1270ZF256 package BSDL model
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