Altera's official MAX 10 Figure 1 sample 10M16DAU484I7G reads as 10M | 16 | DA | U | 484 | I | 7 | G. It identifies the MAX 10 family, 16K logic-element member, dual-supply analog-and-flash feature set with remote system update, 484-pin package code, industrial temperature, fabric speed grade 7 and RoHS6 suffix.
Every field matters. A quote shortened to 10M16 omits the power architecture, analog and flash functions, package footprint, temperature range, speed grade and material suffix.
Open the full-size MAX 10 ordering diagram and zoom.
Decode 10M16DAU484I7G field by field #
| Field | Example | Official meaning | Procurement check |
|---|---|---|---|
| Family signature | 10M | MAX 10 | Do not apply this syntax to MAX V or Cyclone 10 LP. |
| Member | 16 | 16K logic elements | Available members are 02, 04, 08, 16, 25, 40 and 50. |
| Feature option | DA | Dual supply, analog and flash features, with RSU | A different two-letter option can change supplies, ADC availability, flash features and remote update support. |
| Package type | U | Ultra FineLine BGA | Package letters are not interchangeable footprints. |
| Package code | 484 | 484 pins in the official Figure 1 example | Confirm the complete letter-and-number combination, not pin count alone. |
| Temperature | I | Industrial, −40°C to 100°C junction | C is 0°C to 85°C; A is −40°C to 125°C. |
| Fabric speed | 7 | Middle of grades 6, 7 and 8 | Grade 6 is fastest. Timing closure must be rerun for any change. |
| Suffix | G | RoHS6 | ES is engineering sample; P identifies a leaded package. |
Feature options are an electrical boundary #
The feature field is more than a marketing variant. SC, SA and SL are single-supply options; DC, DF, DA and DD are dual-supply options. Compact variants omit functions included by the analog-and-flash variants. SA, SL, DF, DA and DD include the documented remote system update combination, while DD additionally provides flash access control.
DD also has a narrow ordering boundary: Altera limits it to 10M40 and 10M50 devices in F256, F484, F672 and B610 packages. A buyer should therefore copy this field exactly from the approved BOM and verify that the board power tree matches the selected supply architecture.
Package type and package code must stay together #
The official decoder lists WLCSP V36, V81 and Y180; EQFP E144; MBGA M153; UBGA U169 and U324; FBGA F256, F484 and F672; and VPBGA B610. These combinations identify different body sizes, pitches, pin counts and PCB land patterns.
The package code in a real OPN is a package letter plus its number. U324 is a 324-pin UBGA, while F484 is a 484-pin FBGA. The similar-looking number does not make two packages pin-compatible. Altera's current product record confirms that 10M16DAU324C8G and 10M16DAU324I7G both use the same 324-pin Ultra FineLine BGA and tray shipping medium.
Temperature and speed substitutions #
For a shortage-screening example, compare 10M16DAU324C8G with 10M16DAU324I7G. The family, density, feature option and U324 footprint remain the same. The industrial I grade covers a wider low-temperature range than commercial C, and speed grade 7 is faster than grade 8.
That makes I7G a plausible engineering alternate for C8G, but not an automatic purchasing substitution. The engineering owner still needs to recompile the design for the exact target OPN, review timing and power, confirm temperature requirements, regenerate programming files when required, and check current qualification and price. The industrial and faster device may cost more.
Do not reverse this logic. C8G is not a general substitute for I7G because it loses low-temperature coverage and moves to a slower speed grade. Do not substitute another feature option merely because the density and package match.
Pin-to-pin and migration limits #
Altera states that MAX 10 vertical migration applies among different densities in the same package with similar I/O and ADC resources. The migration figure omits non-migratable devices, and some packages contain more than one migration path. Full migration also requires restricting I/O usage to the lowest-I/O device in the intended path.
The official guidance specifically tells designers to verify compatibility in the Quartus Prime Pin Planner Pin Migration View. The I/O guide warns that not all MAX 10 devices support the same 1.0 V I/O capability. ADC migration has additional source-to-target conditions. Therefore same package code is necessary for a pin-to-pin candidate, but it is not sufficient evidence by itself.
Procurement checklist #
1. Copy the complete OPN from the released BOM, including the final suffix. 2. Match the two-letter feature option before evaluating density or speed upgrades. 3. Match package letter and package number; confirm the land pattern and package drawing. 4. Treat a wider temperature grade or faster speed grade as an engineering candidate, not automatic approval. 5. Check Pin Migration View, assigned I/Os, ADC pins, 1.0 V I/O requirements and configuration pins. 6. Recompile for the proposed OPN and review timing, power, programming image and qualification. 7. Record lifecycle, authorized source, date code, quantity, shipping media and price in the RFQ approval.
Conclusion #
A MAX 10 alternate is credible only when the family, feature option and physical package remain aligned and the new temperature and speed grades meet or exceed the approved requirement. Density migration requires the official migration path and a Pin Planner check. Never infer pin compatibility from the shared 10M prefix or pin count alone.
Official references #
- MAX 10 Device Ordering Information — Figure 1
- MAX 10 FPGA Device Overview
- MAX 10 FPGA Product Table
- MAX 10 Vertical Migration Support
- MAX 10 I/O Vertical Migration Support
- MAX 10 ADC Vertical Migration Support
- 10M16 U324 ordering table
- 10M16DAU324C8G product record
- 10M16DAU324I7G product record
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