LIMCHIP CO., LIMITED
Professional Electronic Components Distributor · HK · SZ · SG · Original Stock · Global Shipping

XC7Z100-L2FFG900I

Brand: AMD Xilinx

XC7Z100-L2FFG900I is an AMD/Xilinx Zynq-7000 XC7Z100 SoC pairing a dual-core ARM Cortex-A9 processing system (up to 800 MHz) with 444K logic cells of Kintex-7-class programmable logic, 2,020 DSP slices and 26.5 Mb block RAM. This -2L speed-grade, industrial-grade device ships in the 900-ball flip-chip BGA (FFG900), 31 × 31 mm, 1.00 mm pitch with 16 GTX transceivers.

Stock & Date Code

Brand Part Number Qty D/C Note
Xilinx XC7Z100-L2FFG900I 300 26+ Xilinx XC7Z100-L2FFG900I Zynq-7000 SoC; confirm lot labels, packing condition and allocation by RFQ.

Listed stock and date code are subject to final RFQ confirmation.

Programmable Logic Specifications

ParameterValue / Specification
Family / Architecturex7Z100 Zynq-7000 SoC: dual ARM Cort -A9 PS + Kint -7-class 28 nm PL
Logic Cells444K logic cells (277,400 LUTs, 554,800 flip-flops)
DSP Slices2,020 xSP48E1
Block RAM26.5 Mb (755 × 36 Kb blocks)
ProcessorDual-core ARM Cort -A9 MPCore, NEON + FPU; 32 KB L1 I/D per core, 512 KB L2, 256 KB on-chip RAM
Processor FrequencyUp to 800 MHz (-2L grade)
Transceivers16 x , up to 12.5 Gb/s
Memory InterfaceDDR3 / DDR3L / DDR2 / LPDDR2 controller; Quad-SPI, NAND, NOR
Peripherals2× USB 2.0 OTG, 2× Gigabit Ethernet, 2× SD/SDIO, 2× UART, 2× CAN 2.0B, 2× I2C, 2× SPI, GPIO
Speed Grade-2L
Temperature GradeIndustrial (Tj -40 °C to +100 °C)
Package / Case900-ball flip-chip BGA (FFG900), 31 × 31 mm, 1.00 mm pitch

FPGA / CPLD Features & Applications

  • XC7Z100 Zynq-7000 SoC: dual ARM Cortex-A9 (up to 800 MHz) plus 444K logic cells of Kintex-7-class programmable logic
  • 2,020 DSP48E1 slices and 26.5 Mb block RAM (755 × 36 Kb)
  • 16 GTX serial transceivers up to 12.5 Gb/s
  • Hardened DDR3/DDR3L/DDR2/LPDDR2 memory controller with Quad-SPI, NAND and NOR static memory
  • Rich processing-system peripherals: 2× USB 2.0 OTG, 2× Gigabit Ethernet, 2× SD/SDIO, 2× UART, 2× CAN 2.0B, 2× I2C, 2× SPI, GPIO
  • PCIe Gen2 x8 hardened block with AES/SHA-256 secure boot
  • 900-ball flip-chip BGA (FFG900), 31 × 31 mm, 1.00 mm ball pitch
  • Speed grade -2L; industrial-grade

Need Price & Availability for XC7Z100-L2FFG900I?

LimChip can confirm current lot allocation, 26+ date-code availability, packing condition and shipping schedule for XC7Z100-L2FFG900I.

Listed stock is subject to final RFQ confirmation.

For faster RFQ confirmation, please include:
  • Required quantity
  • Target date code
  • Package / case requirement
  • Delivery country
  • Company name and contact person
  • Target price if available

Prefer email? Send this RFQ via email instead.

Quality, Shipping & Payment

Commercial and shipment details for XC7Z100-L2FFG900I are confirmed with the formal quotation.

Quality Confirmation

Date code, batch, package, label and marking details are checked before shipment. Inspection photos and third-party inspection support are available when required.

Shipping

LimChip supports worldwide delivery through established logistics providers. Carrier, lead time, tracking and buyer-appointed freight-forwarder requirements are confirmed by our sales team.

Payment

Payment method, currency and trade terms are confirmed in the formal quotation or proforma invoice. Contact our sales team for the options available for your order.

Frequently Asked Questions

Is XC7Z100-L2FFG900I available from LimChip?

LimChip can confirm current availability, price, quantity, date code and lead time for XC7Z100-L2FFG900I by RFQ.

What should buyers check before ordering XC7Z100-L2FFG900I?

Buyers should check logic family, speed grade, package, I/O count and lifecycle availability for XC7Z100-L2FFG900I, together with live stock and traceable supply.

How do I request a quote for XC7Z100-L2FFG900I?

Use the RFQ button and include required quantity, target date code, package/case requirement, delivery country, company name and contact details.

Check Stock