The market is separating into high-priority and routine components
May 2026 component activity did not point to one uniform semiconductor cycle. Instead, search interest and inventory movement showed a widening split between parts connected to AI infrastructure, automotive electronics and industrial control, and general-purpose devices serving less constrained applications.
The strongest signals appeared around high-current power delivery, selected FPGA families, memory products and automotive drivers. At the same time, lower search activity across many broad categories showed that calendar effects and weaker consumer demand were still present. Buyers should therefore avoid using one market-wide shortage assumption for every BOM line.
Category and brand signals from May
MCUs remained the largest search category, followed by Flash, MOSFETs, DC/DC converters and operational amplifiers. FPGA was notable because interest moved up rather than down, while BJT transistor searches also increased. At brand level, TI, ADI, ST, onsemi, Microchip, Infineon, Micron and NXP remained highly visible, but most broad brand totals softened during the month. This makes the individual part-number movements more useful than the headline brand ranking.
| Signal area | Representative parts or families | Procurement interpretation |
|---|---|---|
| AI and data-center power | ISL99390, ISL99380, TDA21490, TDA21590 | High-current power stages deserve early RFQ and controller/package checks |
| FPGA and programmable logic | 5CEFA9F23I7N, 10M08SAU169A7G | Selected FPGA demand can strengthen even when broader searches soften |
| Automotive and industrial control | L9369-TR, STM32 families, INA241 | Qualification, suffix and lifecycle checks remain more important than generic availability |
| Memory and storage | DDR3L/DDR4, eMMC, NOR Flash, SLC NAND | Capacity allocation and product transitions create part-specific risk |
| General-purpose analog | LM358, buck regulators, interface ICs | Availability is often better, but quotation validity can still shorten |
May 2026 hot-search part-number list
The part-number ranking is retained because this is a hot-model report, not only a market commentary. The list is a demand signal rather than proof of available stock, shortage or a confirmed price increase. Brand names and ordering codes below have been normalized where the supplied market list was ambiguous; every RFQ still requires an exact suffix and lifecycle check.
| Rank | Part number | Manufacturer | Rank | Part number | Manufacturer |
|---|---|---|---|---|---|
| 1 | STM32F405RGT6 | STMicroelectronics | 26 | W25Q256JVEIQ | Winbond |
| 2 | ICM-42688-P | TDK InvenSense | 27 | LIS3DHTR | STMicroelectronics |
| 3 | STM32F103C8T6 | STMicroelectronics | 28 | ISO1050DUBR | Texas Instruments |
| 4 | W25Q128JVSIQ | Winbond | 29 | INA139NA/3K | Texas Instruments |
| 5 | ISL99390FRZ-TR5935 | Renesas | 30 | TDA21590 | Infineon |
| 6 | MT41K256M16TW-107:P | Micron | 31 | LM5164DDAR | Texas Instruments |
| 7 | MT41K256M16TW-107 IT:P | Micron | 32 | L9369-TR | STMicroelectronics |
| 8 | KLM8G1GETF-B041 | Samsung | 33 | K4B4G1646E-BCNB | Samsung |
| 9 | TPS5430DDAR | Texas Instruments | 34 | STM32F407VGT6 | STMicroelectronics |
| 10 | W25Q64JVSSIQ | Winbond | 35 | ICM-20948 | TDK InvenSense |
| 11 | STM32F407VET6 | STMicroelectronics | 36 | STM32F030C8T6 | STMicroelectronics |
| 12 | TMS320F28335PGFA | Texas Instruments | 37 | TPS54331DR | Texas Instruments |
| 13 | STM32F103RCT6 | STMicroelectronics | 38 | TPS54302DDCR | Texas Instruments |
| 14 | MT40A512M16TB-062E:R | Micron | 39 | ICM-42670-P | TDK InvenSense |
| 15 | W25Q32JVSSIQ | Winbond | 40 | ULN2003ADR | Texas Instruments |
| 16 | PRTR5V0U2X | Nexperia | 41 | INA226AIDGSR | Texas Instruments |
| 17 | LIS2DH12TR | STMicroelectronics | 42 | BAT54S | Multiple manufacturers |
| 18 | STM32H743VIT6 | STMicroelectronics | 43 | AMS1117-3.3 | AMS / compatible sources |
| 19 | TDA21490 | Infineon | 44 | GD25Q128ESIGR | GigaDevice |
| 20 | TPS51200DRCR | Texas Instruments | 45 | STM8S003F3P6TR | STMicroelectronics |
| 21 | LM358DR | Texas Instruments | 46 | NT5CC256M16ER-EK | Nanya |
| 22 | MT41K128M16JT-125:K | Micron | 47 | SN65HVD230DR | Texas Instruments |
| 23 | TPS82130SILR | Texas Instruments | 48 | MT41K128M16JT-125 IT:K | Micron |
| 24 | W25N01GVZEIG | Winbond | 49 | 5CEFA9F23I7N | Altera |
| 25 | SDINBDG4-8G | SanDisk / Western Digital | 50 | STM32F407ZGT6 | STMicroelectronics |
Nexperia entries are retained in the historical ranking for reporting accuracy, but they are not added to the LimChip part database under the current catalogue policy.
Fast-rising search list
| Rank | Part number | Manufacturer | Reported application signal |
|---|---|---|---|
| 1 | L9369-TR | STMicroelectronics | Automotive actuator and body control |
| 2 | ISL99380FRZ-TR5935 | Renesas | AI and server multiphase power |
| 3 | SMP1330-005LF | Skyworks | RF receiver limiting and protection |
| 4 | T31ZX | Ingenic | Smart-video and security-camera processing |
| 5 | INA241A2IDDFR | Texas Instruments | Motor and switching-current sensing |
| 6 | 10M08SAU169A7G | Altera | Automotive and industrial programmable logic |
| 7 | PSMN2R3-100SSE | Nexperia | High-current MOSFET demand signal |
| 8 | REF200AU | Texas Instruments | Precision current source and sensor excitation |
| 9 | W66DP2RQQAHJ | Winbond | LPDDR4X embedded and automotive memory |
| 10 | AD8221ARMZ-R7 | Analog Devices | Precision instrumentation and sensors |
| 11 | RFPA0133TR7 | Qorvo | RF driver and industrial wireless |
| 12 | BCM53112MB1ILFBG | Broadcom | Industrial and enterprise Ethernet switching |
| 13 | UCC256402DDBR | Texas Instruments | LLC resonant power conversion |
| 14 | DAC7512N | Texas Instruments | Industrial analog output and control |
| 15 | M24128-BWMN6TP | STMicroelectronics | Serial configuration memory |
| 16 | MPC8308VMAGDA | NXP | Industrial networking processors |
| 17 | SZESD1L001W1T2G | onsemi | High-speed-line ESD protection |
| 18 | 9ZXL0851EKILFT | Renesas | Server PCIe reference-clock distribution |
| 19 | AP7375-33SA-7 | Diodes Incorporated | Low-current embedded power rails |
| 20 | SMP1330-040LF | Skyworks | Compact RF limiter protection |
Inventory movement watch list
Inventory movement is shown separately because increasing inventory is not automatically bearish and decreasing inventory is not automatically a shortage. Search activity, physical stock, lot count and replacement lead time must be evaluated together.
| Inventory reported higher | Manufacturer | Inventory reported lower | Manufacturer |
|---|---|---|---|
| FT230XS-U | FTDI | MIC5332-SSYMT-TR | Microchip |
| PMEG3020EJ,115 | Nexperia | CA-IS3762LN | Chipanalog |
| MT53E256M32D1KS-046 AUT:L | Micron | MT25QU512ABB8E12-0AUT | Micron |
| STM32L552RET6 | STMicroelectronics | LIS2DUX12TR | STMicroelectronics |
| SKY12325-350LF | Skyworks | H5CG46AGBDX017N | SK hynix |
| STTH6004W | STMicroelectronics | CMD328K3 | Qorvo |
| SIM7600E-H | SIMCom | RC0603FR-0710KL | Yageo |
| MT35XU02GCBA1G12-0SIT | Micron | W66DP2RQQAHJ | Winbond |
| SKY85728-11 | Skyworks | MT53E256M16D1DS-046 WT:B | Micron |
| LCMXO3LF-9400C-5BG484C | Lattice | RZ7899 | RZ Microelectronics |
AI power parts moved beyond a supporting-component role
High-current smart power stages were among the clearest demand signals. Renesas ISL99390 and ISL99380, together with Infineon TDA21490 and TDA21590, are used in multiphase power systems where current monitoring, thermal performance, controller compatibility and board layout are tightly linked.
These parts should not be treated as interchangeable because they share a similar current class. Buyers need the exact ordering code, package, PWM and telemetry interface, controller pairing and approved board configuration. The commercial risk is also different from a commodity power device: one missing power stage can delay an otherwise complete accelerator or server board.
FPGA interest reflected platform demand, not universal interchangeability
Higher FPGA search activity included Altera Cyclone and MAX device families. That is consistent with demand from communications, control, edge processing and infrastructure designs, but search activity alone does not prove a broad shortage across every density and package.
FPGA RFQs must preserve the complete suffix. Device family, logic density, speed grade, temperature grade, transceiver option and BGA footprint can all change between nearby ordering codes. A lower-priced adjacent suffix is not a valid substitute until engineering confirms the device, toolchain, bitstream, pinout and qualification requirements.
Memory remained divided by generation and end market
The May model list contained established Winbond NOR Flash and SLC NAND, Samsung and Micron DRAM, eMMC and industrial-memory products. Some older DDR3L and small-capacity managed-NAND requirements remained active alongside newer server-focused demand.
This is not one memory market. Server DRAM, HBM-adjacent capacity decisions, industrial DDR, serial NOR, SLC NAND and small-capacity eMMC have different supply drivers. Buyers should compare density, organization, voltage, speed, temperature grade, package and full suffix before interpreting a price move.
Inventory growth does not always mean weak demand
Inventory increases were visible in selected FTDI, ST, Micron, Skyworks and programmable-logic products. In some cases, higher stock and higher search interest can occur together because distributors and traders replenish ahead of expected demand. Inventory decline was more visible among selected memory, power-management and passive-component lines.
Neither direction is conclusive by itself. Rising inventory can mean deliberate restocking, delayed consumption or improving supply; falling inventory can mean real demand, allocation, product transition or simply fewer reported offers. The useful check is whether stock movement is accompanied by shorter quotation validity, wider lot fragmentation, higher price or longer replenishment time.
Six checks for hot-search component RFQs
- Match the exact part number and suffix rather than the shortened family name.
- Confirm quantity, date code, lot split and packing condition for the offered stock.
- Ask whether inventory is physically available, incoming or broker-indicated.
- Verify manufacturer lifecycle status and any PCN, EOL or package transition.
- For FPGA, power and automotive parts, obtain engineering approval before substitution.
- Record quotation validity, shipment location, traceability documents and inspection scope.
What this means for Q3 sourcing
The May signals support a selective rather than market-wide response. AI power, specific FPGA packages, automotive drivers and constrained memory should receive earlier RFQ attention. General-purpose products should still be checked, but buyers do not need to convert every softer market signal into emergency stock.
The practical approach is to rank the BOM by single-source exposure, redesign cost, lifecycle risk, lead time and evidence of lot-level tightening. Use the LimChip part database to check exact ordering-code pages and send an RFQ with quantity, target date code, package and approved substitution requirements. Current stock, date code, lot condition and final pricing must be confirmed before purchase.
Need stock, date-code or package confirmation?
Send the part number, quantity, target date code and packaging requirements. LimChip will check available lots and RFQ details before you place the order.
Send RFQ